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Summary of Week 32 – August 3-7, 2026

Top 5 news stories - plus 5 more worth your attention

By Philippe Nicolas | August 10, 2026 at 2:02 pm

Top News

Our selection

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FMS 2026: New 3D Flash Memory Technology from Kioxia and Sandisk Achieves Industry's Highest Bit Density for QLC NAND
10th-generation QLC 3D flash memory represents a major leap forward for AI storage architectures, cloud platforms, and data intensive innovations
August 5, 2026 | Press Release
FMS 2026: Sandisk Showcases NAND Innovation for the Era of AI Inference
With HBF, enterprise SSD and BiCS10 QLC flash
August 5, 2026 | Press Release
Phison: Fiscal 2Q26 Financial Results
Generating NT$67.9 billion, up 66% QoQ and up 280% YoY
August 3, 2026 | Press Release
South Korea Memory Vendors Samsung and SK hynix Signed Major Deals
Clearly one of the red ocean segment of the industry
August 3, 2026 | Press Release
Samsung Electronics and Broadcom Expand Strategic Collaboration Across Memory and Foundry Technologies
Companies sign memorandum of understanding to broaden collaboration on next-generation AI infrastructure, spanning leading-edge memory, foundry technologies and advanced packaging
August 3, 2026 | Press Release
Samsung Electronics: Fiscal 2Q26 Financial Results
Generating KRW 171.5 trillion, up 28% QoQ and up 130% YoY
July 31, 2026 | Press Release
SK hynix: Fiscal 2Q26 Financial Results
Revenue at ₩79.3187 trillion, up 50% QoQ and up 257% YoY
Top News | July 30, 2026 | Press Release
CXMT Priced its Well Anticipated IPO
Raising around $8.5 billion
By Philippe Nicolas | July 21, 2026 | News
Amazing IPO for SK hynix
Confirming its recent trajectory in DRAM, HBM and NAND
By Philippe Nicolas | July 17, 2026 | News
Kioxia and Sandisk Begin Production of 10th-Generation 3D Flash Memory Products at Kitakami Plant Fab2
Companies showcase ongoing buildout of manufacturing infrastructure at K2 to address growing demand for NAND flash
Top News | July 10, 2026 | Press Release
Samsung Begins Mass Production of PM1763 SSD Optimized for Next-Generation AI Infrastructure
Based on company's NAND last generation with PCIe 6 interface
July 9, 2026 | Press Release
Sandisk Announces Sampling of BiCS10 1Tb TLC 3D NAND Flash Memory Pushing Density, Power Efficiency and Performance to Support Data-Intensive Workloads
BiCS10 TLC delivers up to 4.8Gb/s NAND interface speed, 59 percent bit density improvement compared to BiCS8 and enhanced power efficiency
Top News | July 8, 2026 | Press Release
SK hynix Ships Samples of 12-Layer Next-Gen HBM4E
Delivering new performance levels
July 7, 2026 | Press Release
Samsung Electronics and SK hynix Will Invest a Combined 800 Trillion Won ($518 Billion) in Building a New Computer Chipmaking Hub in South Korean
Capitalizing on surging AI-driven demand
Top News | By Philippe Nicolas | July 3, 2026 | News
CXMT Secured a Large Deal with Tencent for $3 Billion
For at least 3 years
By Philippe Nicolas | July 2, 2026 | News
Computex 2026: Phison Collaborates with Intel to Bring Larger Local AI Workloads to Intel AI PC Platforms
Phison's Pascari aiDAPTIV removes local memory constraints on client PCs, enabling larger MoE AI models and agentic AI applications
June 3, 2026 | Press Release
Computex 2026: Phison Transforms into a Full-Scale AI Enabler
Building an Ecosystem with Pascari aiDAPTIV
June 2, 2026 | Press Release
WD Advances Next-Generation Trusted Infrastructure with Industry's First Post-Quantum Cryptography HDDs to Help Secure the Future of AI Data
Ultrastar HDDs currently in customer qualification introduce PQC-ready secure boot and firmware protection, establishing a new standard for device trust in the Quantum Era
June 1, 2026 | Press Release
CXMT Ready for its IPO
Following a stellar 1Q2026 up700% YoY
By Philippe Nicolas | May 22, 2026 | News
Computex 2026: Phison's Pascari Enterprise Storage Honored with Computex Best Choice Golden Award for Breakthrough 245.76TB Capacity
Another award reaffirming Phison's position and the relevance of the Pascari product line
May 22, 2026 | Press Release
WD: Fiscal 3Q26 Financial Results
Revenue of $3.34 billion, up 45% YoY and up 11% QoQ
Top News | May 5, 2026 | Press Release
WD Raises the Bar on Sustainable Infrastructure as AI Storage Demand Accelerates
FY2025 annual sustainability report highlights industry recognition, ambitious targets, and breakthrough circularity innovation
April 30, 2026 | Press Release
China's CXMT Aims to Build Country's First Advanced Memory Chips for AI
Move intended to cut dependence on foreign suppliers SK Hynix, Samsung and Micron
By Jean Jacques Maleval | February 12, 2024 | News
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