These TLC SSD Series marks the company’s continued development with 3D NAND design, bringing better efficiency, faster performance, and increased capacity. Compared to the previous 96-layer technology that offered a maximum of 2TB storage, the 112-layer PCIe Gen 4×4 series increase the capacity to 8TB for U.2 SSD, while increased the capacity to 4TB for M.2 (P80). Beyond capacity increases, 112-layer is also faster, with the PCIe Gen 4×4 series clocking in at speeds up to 7,500/6,700MB/s (8CH) and 3,800/3,000MB/s (4CH). The marked increase in performance meets the growing needs of AIoT applications and industries in 5G, edge computing, deep learning, smart surveillance and smart medical where speed and higher capacity support are critical.
These 112-Layer 3D TLC SSD series also boasts other improvements to fit industrial and IoT market demand. Reliability is paramount, so a 2-pronged approach of ECC correction by LDPC within a page and RAID between blocks provides a double layer of protection for greater data security. Consistent and stable linear performance is implemented through a direct write mode that reduces performance drops and WAF. The firm’s 112-layer series also features better endurance, greater data security with built-in iDataGuard and iPowerGuard, enhancing compatibility and protection in critical power environments and ensuring sudden power loss data integrity.
The company estimates mass production of 112-Layer 3D TLC series in 3Q21 to WW customers.