Embedded World: Exascend Pushing Storage Beyond Boundaries

Exascend, Inc. is set to showcase its latest innovations at Embedded World 2024 in Nuremberg, Germany from April 9-11.

Renowned for pushing the boundaries of storage technology, the company invites attendees to explore the possibilities of Storage Beyond Boundaries.

The firm’s portfolio offers reliability, performance, and data integrity across various industries, ensuring operation in extreme environments. Visitors to the booth will have the opportunity to engage with the company’s team and witness the firm’s commitment to technological advancement.

Key highlights :

• Radiation hardened storage: Get a firsthand look at the company‘s radiation-hardened PCIe Gen4 storage solutions, featuring advanced technology for radiation-induced bit flip correction, LDPC enhanced mode, and dual-copy firmware protection – for aerospace and mission-critical applications.

• Automotive storage: Explore the firm‘s automotive-grade SSD, eMMC, and BGA SSD offerings, designed to deliver reliable performance in temperature ranges from -40°C to +105°C. The compact eMMC and BGA SSDs ensure vibration resistance and prioritize reliability through advanced wear-leveling, error correction, power loss protection, and thermal management.

• Rugged storage: Witness the waterproof capabilities of the company’s SSDs with conformal coating and underfill technologies, providing protection vs. humidity, shock, vibration, and harsh environmental factors.

In a testament to its collaboration with industry leaders in storage solutions, the firm will also feature a showcase area at Micron’s booth, highlighting storage solutions tailored for cinematography, automotive, and mission-critical applications.

Additional onsite showcases:

• Wide-temperature DDR4 DRAM modules for embedded systems
• Industrial and enterprise-grade NVMe and SATA SSDs
• Industrial removable storage solutions including CFexpress, CFast, SD, and microSD cards