These products, equipped with 3D TLC NAND flash technology, are designed to withstand temperatures up to 105°C and cater to automotive applications, including ADAS, in-vehicle infotainment, navigation, and high-definition mapping.
EM500 series e.MMC
The EM500 offers capacities from 4 to 256GB and delivers sequential RW speeds up to 295MB/s and 210MB/s in HS400 data transfer mode. The EM500 series comes in a compact 153-ball FBGA package compliant with the JEDEC e.MMC v5.1 standard. Features include LDPC ECC, power loss protection, wear leveling, IO/s optimization, read disturb prevention, secure erase, write protection and Field Firmware Update (FFU). Furthermore, the company provides customizable firmware and long-term support to meet specific customer requirements.
microSD500 series memory card
For removable storage requirements, the microSD500 series comes in capacities from 8G to 256GB with speed class V30/U3/C10 and performance class A2. Its ruggedized and IP67-rated design meets stringent criteria for shock, vibration, temperature, and humidity. The microSD500 also incorporates technologies including LDPC ECC, wear leveling, and pseudo SLC (specifically for 8 and 16GB cards) to deliver performance, low storage latency, and endurance.
Manufactured in the firm’s IATF 16949 certified facility, both the EM500 and microSD500 undergo quality control testing, including temperature burn-in tests spanning from -40°C to +105°C, ensuring performance even in the harshest conditions. Both series are currently undergoing AEC-Q100 Grade 2 qualification.
“As data from connected and autonomous vehicles grows exponentially, the next generation of these vehicles requires robust storage to enable cutting-edge applications,” said Frank Chen, CEO. “Our new EM500 and microSD500 series offer uncompromising reliability and performance engineered specifically for demanding automotive workloads.”
Samples of the EM500 and microSD500 are available.