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Everspin Sampling STT-MRAM EM128LX xSPI 128Mb Memory

Up to 233MB/s full RW bandwidth means that system designers have option of merging code and data memory on same device, reducing cost, power, and area.

Everspin Technologies, Inc. has engineering samples of its high-density STT-MRAM, the EM128LX.

Everspin Em064lxo 2208

This product supports the Expanded SPI (xSPI) standard protocol and has a capacity of 128Mb, 2x that of the previously announced 64Mb EM064LX.

The combination of increased density with up to 233MB/s RW bandwidth means that system designers have the option of merging code and data memory on the same device, reducing cost, power, and area. With fast write speed and data persistence, the EM128LX will provide FPGA system designers with fast configuration, instant-on boot capability, and rapid updates of critical application parameters such as weighting tables in AI applications.

We are pleased to offer our customers this new level of capacity and unprecedented writing speed. Everspin is leading the way in the ability to unify memory functions in one chip while maintaining ease-of-use for system designers,” said Sanjeev Aggarwal, president and CEO.

The EM128LX is offered in 2 industry standard package types, a 24-ball BGA and 8-pin DFN. Firm’s advanced STT-MRAM provides over 10 years of data retention, virtually unlimited write cycle endurance, and comes complete with the xSPI interface that supports NOR Flash and serial SRAM operating modes.

System designers using FPGAs will benefit from the fast configuration updates made possible with the write speed and density of this latest STT-MRAM offering,” said Allan Cantle, CEO, Nallasway Inc. “Getting to Octal xSPI and 128Mb capacity enables shorter development times for a wide range of commercial FPGA families.

The JEDEC xSPI standard is expected to become a prevalent way to access data memory and code storage in embedded systems.

Customer samples are available for shipment , volume production shipments of the EM128LX will start in the early part of 2023.

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