What are you looking for ?
Mobile Search Icon
Mobile Menu Icon
Infinidat
Rubrik

ATP Electronics Extends 3D TLC NAND e.MMC Devices Endurance to MLC/SLC Levels

Comply with JEDEC e.MMC v5.1 standard, supporting fast 400 DDR mode for up to 400MB/s, E750Pi and E650Si Series operable at -40°C to 85°C, and E750Pc and E650Sc at -25°C to 85°C for applications with non-critical thermal requirements

This is a Press Release edited by StorageNewsletter.com on February 25, 2022 at 2:01 pm

ATP Electronics, Inc. has introduced its latest line of e.MMC devices built on 3D TLC NAND.

Using a new die package, the E750Pi/Pc and E650Si/Sc Series offer long-life performance, optimized power consumption and customizable configuration option...

To get one-year unlimited access to all the News 50,000+ original articles, market reports, company's profiles, press releases, etc. on the worldwide storage industry published by StorageNewsletter.com since November 2007.

One year subscription for €99

If you have already subscribed, please enter your credentials below:

Read also :
ATP stellt zwei neue Serien von Embedded SSDs
Flash-Die-Design verlängert die Lebensdauer von TLC-SSDs "um 66%".
November 29, 2021 | Press Release
ATP A750Pi and A650Si/Sc Embedded 3D TLC Up to 1,920GB SSDs Match MLC Endurance With "66% Higher Endurance" Than Other 3D TLC Drives
Pseudo SLC mode yields "50% higher endurance", on par with SLC.
October 22, 2021 | Press Release
ATP A600Sc Series SATA SSDs Qualified for Compatibility and Interoperability With Microchip Tri-Mode Storage Adapters
Also with SmartHBA 2200 and HBA 1200 smart storage adapters
August 20, 2021 | Press Release
ATP N700 Series PCIe Gen3 x4 NVMe SSDs in M.2 Type 1620 HSBGA Package Tiny NVMe Storage Solutions
40/80/160GB, built with 3D TLC configured as pSLC NAND flash, and consuming low power at 5mW under Power State 4
May 4, 2021 | Press Release
ATP SecurStor microSD Up to 16GB Cards With Secure Boot and HW AES-256 XTS Encryption
Multi-layered privileges, sanitization features offer storage security to safeguard data from unauthorized access.
April 19, 2021 | Press Release
ATP Electronics: NVMe Flash Storage Solutions With Customizable Thermal Management
Introduces Copper foil, fintType Heatsink/Thermal pad for NVMe M.2/U.2 SSDs with up to 3.84/8TB capacity.
April 7, 2021 | Press Release
Cohesity