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ATP Electronics Extends 3D TLC NAND e.MMC Devices Endurance to MLC/SLC Levels

Comply with JEDEC e.MMC v5.1 standard, supporting fast 400 DDR mode for up to 400MB/s, E750Pi and E650Si Series operable at -40°C to 85°C, and E750Pc and E650Sc at -25°C to 85°C for applications with non-critical thermal requirements

ATP Electronics, Inc. has introduced its latest line of e.MMC devices built on 3D TLC NAND.

Using a new die package, the E750Pi/Pc and E650Si/Sc Series offer long-life performance, optimized power consumption and customizable configuration option...

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