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ATP N700 Series PCIe Gen3 x4 NVMe SSDs in M.2 Type 1620 HSBGA Package Tiny NVMe Storage Solutions

40/80/160GB, built with 3D TLC configured as pSLC NAND flash, and consuming low power at 5mW under Power State 4

ATP Electronics, Inc. has announced its NVMe flash storage offering, the N700 Series PCIe Gen3 x4 NVMe SSDs, which are available as M.2 Type 1620 HeatSink Ball-Grid Array (HSBGA) package.

Atp N700 Series Pcie Gen3 X4 Nvme Ssds Intro

Complying with M.2 specs, the M.2 Type 1620 HSBGA measures 16(L)x20(Wx1.6 (H) mm, supporting PCIe 3.0 interface x4 lanes and NVMe protocol to deliver up to 32Gb/s bandwidth at 8Gb/s per lane. The soldered-down design makes them vibration-proof, while the 291-ball packaging takes up minimal space within tightly confined systems.

For customers who prefer a removable and field-replaceable design, the company can accommodate the HSBGA onto an M.2 2230 module with the same firmware and NAND configuration. Both variants are suitable for thin and light systems in embedded, industrial and mobile applications.

N700 Series SSDs are built with 3D TLC configured as pseudo SLC (pSLC) NAND flash. By storing only one bit per cell, they increase the reliability and endurance of the NAND flash memory, while benefiting from the lower cost compared with native SLC, due to the higher cell density.

These SSDs are outfitted with a heatsink on top, which complements system airflow to enhance heat dissipation and keep the BGA SSD cool while offering 2x-3x better sustainable performance.

The optimized power consumption of 5mW during Power State 4 (sleep mode) translates to power savings.

BGA SSD technology allows the NAND flash and controller to be integrated into one package that is lightweight yet offers performance and capacities. N700 Series SSDs come in 40/80/160GB and are packed with features to meet theportability and reliability requirements of compact IoT devices and embedded systems. They provide high-speed reliable storage in harsh environments such as in transportation, aerospace, smart factories, mining operations, steel fabrication.

N700 Series SSDs are available in both C-Temp (0°C to 70°C) and I-Temp (-40°C to 85°C) ratings. They all undergo tests, such as Rapid Diagnostic Testing (RDT), to screen out weak blocks and ensure reliability and robustness even in extreme operating conditions.

Atp N700 Series Pcie Gen3 X4 Nvme Ssds

N700 Series key features:

  • pSLC mode. Configured to store only one bit per cell to increase endurance and reliability, offering 2x-3x sustainable performance.

  • Stable performance. The company’s Optimized Thermal Throttling firmware (FW) will maintain the ‘Steady State’ condition to avoid huge performance drops that will adversely impact the system, thus optimizing best performance for application requests and enhancing overall sustained performance.

  • Optimized power consumption. Consuming low power at 5mW under Power State 4 (sleep mode), the NVMe HSBGA SSDs deliver power savings.

  • DRAM-less configuration. Host Memory Buffer (HMB) support helps these DRAM-less SSDs to improve performance by obtaining DRAM resources as cache, thus overcoming the limited memory capacity within the storage and optimizing I/O performance without requiring the SSD to bring up its own DRAM

  • Vibration-resistant storage. N700 Series SSDs in M.2 Type 1620 are soldered down, making them vibration-resistant and able to withstand rigorous shaking.

  • Better thermal dissipation. The heatsink transfers heat to cool the device and keep the performance at optimal levels.

  • Optional security features:

      • HW Write Protect

      • HW Quick Erase

      • HW Secure Erase

      • SW Data Sanitization (AFSSI-5020)

      • AES-256 Encryption

      • TCG Opal 2.0

Click to enlargeAtp Hbga M.2 Type 1620 Spectabl

 

(*) Full user capacity SLC mode
(**) All performance is collected or measured using ATP proprietary test environment, without file system overhead.
(***) Case Temperature, the composite temperature as indicated by SMART temperature attributes.
(****) Under highest sequential write value. May vary by density, configuration and applications.

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