Veeco Releases New 3D Atomic Force Microscope
Designed for HDD patterned media
This is a Press Release edited by StorageNewsletter.com on October 10, 2008 at 2:48 pmVeeco Instruments Inc., a provider of instrumentation to the nanoscience community, introduced a new version of its InSight 3D Automated Atomic Force Microscope (3DAFM) specifically designed to deliver accurate three-dimensional metrology on advanced 32nm and 22nm photomasks. The InSight 3DAFM-PM incorporates a number of hardware and software enhancements to provide high throughput and sub-nanometer measurement uncertainty for critical dimension (CD) and depth metrology on a variety of photomask features and material types. In addition to semiconductor applications, the InSight 3DAFM-PM has been designed to meet the hard disk drive industry’s challenging metrology requirements as it incorporates nano-imprint masks in new patterned media technology.
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Mark R. Munch, Ph.D., Executive Vice President, Veeco Metrology commented: "The InSight 3DAFM-PM tool stands alone in its ability to provide non-destructive three dimensional profile metrology and production-based depth metrology for advanced masks. The system also enables significant improvements in cost of ownership, with improved throughput and a significant reduction in cost per measurement for CD metrology."
"The InSight 3DAFM-PM has already demonstrated capability on advanced 22nm node nano-imprint masks and is unique in its ability to measure accurate profile on this technology," states Paul Clayton, Vice President, Veeco’s Automated AFM Business. "In addition, this platform enables process development times to be improved with full profile characterization of resist and MoSi structures as well as chrome and other mask materials."
About InSight 3DAFM-PM
The InSight 3DAFM-PM features an innovative metrology platform designed to meet the stringent requirements of 32 and 22nm advanced photomask and nano-imprint metrology applications, such as CD, sidewall angle and line width roughness on critical layers. The system contains a new high-precision X-Y stage with improved accuracy and a unique pattern recognition system with high-precision laser auto-focus capability. In addition, new
AFM control techniques and proprietary probe designs enable improved precision, lower cost per measurement site and smaller feature measurement. Finally, system reliability is significantly enhanced to meet the demands of 32 and 22nm production-based metrology.











