Electronica 2026: Biwin to Showcase Advanced Storage Solutions for AI, Edge, Automotive, and Next-Generation Electronics

Biwin, a provider of memory and storage solutions, will exhibit at electronica 2026, November 10-13 at Messe München in Munich, Germany. This year’s showcase brings together Biwin technologies for AI infrastructure, industrial edge computing, intelligent vehicles, embedded devices, and compact PCs.

Biwin develops storage for systems with very different demands, from data centers processing AI workloads to wearables with limited board space to industry 5.0 platforms running 24/7. Its in-house capabilities span hardware, firmware, storage algorithms, packaging, testing, and manufacturing, supporting product development across a wide range of applications.

From AI Infrastructure to the Edge
Biwin’s PCIe 5.0 enterprise SSD portfolio is built around solutions for the different workloads and deployment priorities found across modern data infrastructure.

The SP509/SP519 series comprises high-performance, highly reliable PCIe Gen5 x4 enterprise SSDs optimized for the demanding I/O requirements of AI training and inference. The series delivers sequential read/write speeds of up to 14,700/9,000 MB/s and 4K random read/write performance of up to 3,200K/800K IOPS. The SP5002 leverages high-density QLC NAND technology to deliver up to 61.44 TB in EDSFF form factors, making it ideal for data lakes, cloud infrastructure, and high-density storage. The SP5010, a 2.5-inch U.2 PCIe Gen5 x4 enterprise SSD, offers up to 122.88 TB per drive, combining exceptional storage density and sequential throughput with reduced power consumption, rack footprint, and data center TCO. Designed for hyperscale environments, the SP506/SP516 series of 2.5-inch U.2 PCIe Gen5 x4 enterprise SSDs combines PCIe 5.0 performance with OCP 2.0 compliance and high performance-per-watt efficiency.

Rather than applying one enterprise SSD design across every workload, Biwin develops around different priorities in endurance, density, power efficiency, interoperability, and latency.

For highly integrated devices, the design priorities change. The Biwin ePoP5X combines LPDDR5X memory and eMMC storage in a compact Package-on-Package solution, reducing the PCB space required for separate components. It gives designers of premium smartwatches, AI glasses, and other space-constrained devices more flexibility to accommodate memory and storage within increasingly compact hardware.

Biwin applies its storage engineering across both ends of the computing spectrum, from scaling data infrastructure to fitting more capability into increasingly compact AI edge devices.

Industrial Storage Built for Continuous Workloads
The Biwin TGS601 Industrial SSD is engineered for sustained, always-on workloads in industrial and edge systems.

At its core is Win-REC, Biwin’s proprietary intelligent write algorithm developed for continuous video recording. A single TGS601 can support recording from up to 24 simultaneous video streams while maintaining consistent write performance, helping reduce frame drops and recording interruptions in surveillance and other video-intensive deployments.

Wide-temperature operation from -40°C to 85°C, full-capacity onboard DRAM, hardware-based power-loss protection, and multi-layer data protection further support deployment in autonomous security systems, intelligent transportation, in-vehicle surveillance, edge computing, industrial servers, and other demanding environments.

With the TGS601, Biwin brings workload-specific optimization into the drive itself, targeting the sustained write behavior and operating conditions that define industrial storage in the field. The Biwin TGS601 provides the high-capacity buffer for Edge AI perception engines and the ruggedized, fail-safe platform needed for Physical AI control loops.

Automotive Storage for Data-Driven Vehicles
Biwin’s automotive storage portfolio covers the growing data requirements of intelligent cockpits, infotainment, navigation, digital instrument clusters, T-BOX modules, and domain controllers.

The TAU208 UFS 3.1 combines automotive-grade reliability with intelligent power and storage management. Its Deep Sleep mechanism can reduce sleep-mode power consumption by up to 95%, while Performance Throttling Notification and Error History logging provide additional capabilities for managing storage within vehicle systems.

The TAE308 eMMC 5.1 extends the portfolio with an embedded solution built around Biwin’s self-developed controller. AEC-Q100 Grade 2 qualification and operation from -40°C to 105°C support reliable deployment across demanding automotive environments.

Together, TAU208 and TAE308 give automotive platform developers storage options for different performance and integration requirements as vehicle architectures become more centralized, connected, and software-defined.

Compact Storage for New Device Designs
The Biwin BL130 Mini SSD brings PCIe Gen4 storage into an ultra-compact removable form factor.

With sequential read speeds up to 3,700 MB/s and capacities up to 2 TB, the BL130 gives OEMs a way to bring SSD-class storage into handheld gaming devices, compact PCs, smart cameras, edge AI platforms, and other systems where internal space is limited.

Its smaller footprint opens valuable room inside the device, giving product designers greater flexibility over system layout while making thinner, more integrated designs possible without sacrificing removable storage.

Biwin approaches miniaturization from multiple directions across its portfolio. The BL130 reduces the footprint of removable high-performance storage, while ePoP5X combines memory and storage within a single package. Both address physical integration as part of storage engineering.

Storage Designed Around the Application
Biwin’s products at electronica address storage challenges at very different scales. The SP5002 brings higher density to data infrastructure with capacities up to 61.44 TB, while the TGS601 uses Biwin’s Win-REC algorithm to handle sustained multi-channel video recording. For space-constrained hardware, ePoP5X integrates memory and storage in a single package, and the BL130 brings removable PCIe storage into a much smaller footprint.

The differences go beyond form factor or performance. Biwin develops each solution around how and where the storage will be used, with product architecture and firmware shaped by the demands of the target system.

Visit Biwin at electronica 2026
Meet Biwin at electronica 2026 to see the latest enterprise, embedded, industrial, automotive, and PC OEM storage technologies and speak with the team about platform requirements and storage development.