Intel: Fiscal 3Q26 Financial Results

Summary:

Third-quarter revenue was $16.5 billion, up 21% YoY
Third-quarter EPS attributable to Intel was $0.60; non-GAAP EPS attributable to Intel was $0.52
Forecasting fourth-quarter 2026 revenue of $15.0 billion to $16.0 billion; forecasting fourth-quarter EPS attributable to Intel of $0.10 and non-GAAP EPS attributable to Intel of $0.25

Intel Corp. reported third-quarter 2026 financial results.“Our Q3 results demonstrate improving execution, meaningful progress expanding supply and continued advancement of our process technology,” said Lip-Bu Tan, CEO, Intel. “Despite near-term headwinds across the PC industry, demand for our CPUs remains robust, reinforcing our confidence in the long-term growth opportunities for our business. Our immediate priority is to unlock additional supply to meet extraordinary demand for our Xeon family, while strengthening our product portfolio and roadmap. We are moving with urgency and focus to capitalize on these opportunities to deliver sustainable growth and long-term shareholder value.”

“We delivered another solid quarter. Revenue, gross margin and earnings per share exceeded guidance, including our strongest data center revenue growth in 15 years,” said David Zinsner, CFO, Intel. “Looking ahead, we see the PC slowdown continuing at least through the first half of next year, but we remain optimistic about the opportunities across our broader portfolio, and we will continue making disciplined investments in capacity and working capital to increase supply and support future growth.”

Q3 2026 Financial Results

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In the third quarter, the company generated $5.1 billion in cash from operations.

Business Unit Summary

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Business Highlights
Company Momentum

Completed a $23 billion public equity offering to support future growth opportunities while maintaining a strong balance sheet and investment-grade rating
Announced plans to acquire Classiq, combining its quantum software synthesis platform with Intel’s spin-qubit manufacturing and software expertise to create a full-stack quantum computing platform

Product Momentum

Announced plans for a multiyear collaboration with Oracle intended to expand Intel Xeon-based computing on Oracle Cloud Infrastructure (OCI), which is expected to span current and future Intel Xeon platforms, including planned OCI X14 offerings powered by Intel’s next-generation server processor code-named Diamond Rapids
Shared new technical details on the Intel GPU D-series, formerly code-named Crescent Island, introduced new Intel Xeon-based rack designs and highlighted open software and ecosystem innovations at OCP Global Summit 2026. Intel also demonstrated day-0 support for Meta’s Muse Spark Open, which has been tested and is running on the upcoming Intel GPU D-series and Intel Xeon platforms
Showcased three architectures for Agentic AI and Enterprise-scale workloads at Hot Chips 2026: next-generation Intel Xeon code-named Diamond Rapids for high-performance orchestration, Intel GPU D-series for efficient inference, and Intel Core Series 3 for intelligent client and edge computing
Announced the first Googlebook devices powered by Intel Core Ultra Series 3 processors with premium devices from Acer, ASUS and Lenovo, bringing together Google’s next-generation computing and Intel’s flagship client platform
Collaborated with AMD to bring x86 CPU optimizations for PyTorch together in oneDNN, simplifying AI development and deployment across Intel and AMD CPUs
Announced a collaboration with SAP to bridge business IT systems and the operational technology that controls physical equipment and processes through Physical AI

Foundry Momentum

Released Intel 14A 0.9 process design kit (PDK) in October
Announced a collaboration with Lens Technology, combining Intel’s advanced packaging expertise with Lens Technology’s precision glass processing capabilities to enable advanced semiconductor packaging for the AI era
Completed the RAMP-C program, enabling validated prototypes, ecosystem readiness and early customer engagement to accelerate momentum for Secure Enclave
Announced a collaboration with ASML to accelerate industry readiness for High-NA EUV manufacturing
Collaborated with Lam Research and Applied Materials on new facilities to expand capacity and enable joint R&D in process technology and manufacturing equipment

Culture & Leadership

Appointed Dean Jarnac as executive vice president and chief sales officer, leading Intel’s global sales organization and strengthening customer relationships and go-to-market execution across the company’s product portfolio