FMS 2026: Biwin to Showcase its Next-Generation Memory and Storage Innovations

Biwin, a provider of memory and storage solutions, is pleased to announce its participation in FMS: the Future of Memory and Storage 2026, taking place at the Santa Clara Convention Center, California.At Booth #619, Biwin will showcase its latest innovations across enterprise, embedded, industrial and automotive, PC OEM, and emerging storage technologies, demonstrating its continued commitment to advancing storage for AI, edge computing, and data center applications.

As AI, cloud computing, and edge intelligenerationce continue to reshape storage requirements, the industry demands higher performance, greater storage density, improved power efficiency, and long-term reliability across every computing tier. At FMS 2026, Biwin will present solutions spanning embedded systems, industrial computing, enterprise infrastructure, and AI-driven workloads, helping customers build faster, more efficient, and more reliable storage platforms.

Key Product Highlights at FMS 2026

Enterprise Storage: Accelerating AI and Cloud Infrastructure

• Biwin SP5002 E3.S & E1.L Enterprise SSDs
  Purpose-built for hyperscale data centers and AI computing clusters, the Biwin SP5002 combines ultra-high storage density with exceptional read throughput to accelerate today’s data-intensive enterprise workloads. Featuring the latest EDSFF E3.S & E1.L form factors, capacities up to 61.44TB, and sequential read speeds of up to 14,700MB/s, it enables more efficient infrastructure scaling while reducing rack space, power consumption, and total cost of ownership. Optimized for AI dataset loading, cloud storage, data lakes, distributed storage, and other read-intensive applications, the SP5002 delivers the performance, density, and reliability required by modern data center infrastructures

Embedded Memory & Storage: Ultra-Compact Integration for AI-Driven Mobile Devices

• Biwin ePoP5X (eMMC 5.1 + LPDDR5X Package-on-Package Solution)
  Designed for the next generation of AI-powered mobile devices, the Biwin ePoP5X integrates LPDDR5X memory and eMMC 5.1 storage into an ultra-compact Package-on-Package (PoP) solution that maximizes performance while minimizing board space. Delivering memory speeds of up to 8,533MT/s in a smaller footprint than the previous generation, it enables slimmer device designs while supporting the performance requirements of premium smartwatches, AI glasses, and other space-constrained mobile platforms

Industrial & Automotive Storage: Engineered for Reliable Operation in Demanding Environments

• Biwin TGE408 Industrial eMMC
  Built for industrial-grade embedded systems, the Biwin TGE408 combines Biwin’s in-house controller, proprietary firmware, and Win-pSLC endurance architecture to ensure dependable operation across temperatures from -40°C to +85°C. Featuring advanced data protection, wide-temperature support, and flexible customization, it is well suited for industrial automation, power and energy systems, medical equipment, in-vehicle infotainment, and other embedded deployments where durability and operational continuity are essential
• Biwin TGQ203 & TGQ205 Industrial PCIe SSDs
  The Biwin TGQ Series delivers a balanced combination of high performance, reliability, and deployment flexibility for industrial computing. Headlined by the flagship TGQ203, with sequential read/write speeds of up to 7,100/6,400MB/s and capacities of up to 4TB, the series also features wide-temperature operation, comprehensive data protection, and flexible hardware and firmware customization to meet diverse industrial requirements. Optimized for AI edge computing, intelligenerationt surveillance, transportation, and industrial automation, the TGQ Series provides the performance and long-term stability required for mission-critical applications

PC OEM Solutions: Next-Generation Memory for Modern Computing

• Biwin BL130 Mini SSD
  Bringing SSD-class performance to space-constrained designs, the award-winning BL130 Mini SSD combines PCIe Gen4 read speeds of up to 3,700MB/s, capacities of up to 2TB, and an ultra-compact form factor to give system designers greater flexibility without sacrificing performance. Designed for handheld gaming devices, edge AI platforms, smart cameras, portable storage, and other embedded systems, it enables high-performance storage in applications where size, speed, and integration are equally critical

Visit Biwin at FMS 2026
Discover how Biwin is advancing memory and storage technologies for the AI era. From embedded memory and industrial-grade storage to PC OEM solutions and enterprise SSDs, our latest portfolio is engineered to help customers build faster, more reliable, and more efficient computing platforms across a wide range of applications.

Visit the Biwin team at Booth #619 to explore our newest innovations, discuss your storage requirements, and learn how our vertically integrated design and manufacturing capabilities can support your next-generationeration products.