ECOC 2025: Marvell to Showcase Interconnect Portfolio for Accelerated Infrastructure

Marvell Technology, Inc. announced it will showcase its extensive interconnect portfolio for scale-up and scale-out data center AI deployments at the European Conference on Optical Communication (ECOC), September 28 to October 2, 2025, in Copenhagen, Denmark.The rapid evolution of GenAI technologies and large-scale models is redefining data center architectures, driving unprecedented demand for interconnect performance, bandwidth and power efficiency. This transformation is accelerating the need for high-performance silicon, advanced memory architectures and tightly integrated optical connectivity. As hyperscalers scale massive AI compute clusters across racks, campuses and multi-site topologies, interconnect technologies must be developed to deliver efficiency, scalability and workload-optimized performance.

Marvell is addressing this challenge with a full-stack approach – combining advanced silicon platforms, chiplet-based architectures and breakthrough optical technologies. Together, these innovations unlock new levels of performance across scale-up and scale-out fabrics, reduce latency, lower power consumption, and enable faster deployment at cloud scale.

At ECOC 2025 (stand #C4134), the company will showcase technologies that will drive the next-gen of AI interconnects, including:

• Co-packaged Optics (CPO) for AI Scale Up: CPO platform supporting 200G/lane connectivity for energy-efficient, high-bandwidth links spanning multiple racks within an AI scale-up domain.
• COLORZ 800G ZR/ZR+ for Multi-Site AI Training: Industry-first family of 800Gb ZR/ZR+ coherent pluggable optical modules. Supports transmission up to 2,000km, enabling cost-effective, scalable data center interconnect (DCI) between geographically distributed AI clusters.
• 200G/Lambda 1.6T PAM4 Optical Interconnect: Marvell Ara, the industry-first 3nm PAM4 DSP, combines 8x200Gb channels inside a single optical module, enabling rapid deployment of AI scale-out fabrics across rows and data halls.

The firm’sexperts will also deliver presentations on interconnect technologies designed to scale accelerated infrastructure:

• Market Focus: Outlook for Coherent Lite Technologies and Markets – Date: Monday, September 29, 2025- Time: 10:20 – 10:35 a.m. CET – Presenter: Bo Zhang, senior principal engineer, Marvell
• Product Focus: 800G Coherent DSP and Beyond – Date: Monday, September 29, 2025- Time: 12:00 – 12:30 p.m. CET – Marvell Presenter: Bo Zhang, senior principal engineer
• Product Focus: Revolutionizing Rackscale Connectivity Using Co-packaged Copper and Optics – Date: Monday, September 29, 2025 – Time: 4:00 – 4:30 p.m. CET – Presenters: Rohan Gandhi, product management, switch, Marvell, and Matthew Burns, director, technical marketing, Samtec
• Impact of Equalizer-Enhanced Phase Noise for Coherent Pluggables – Date: Thursday, October 2, 2025 – Time: 9:30 – 10:00 p.m. CET – Marvell Presenter: Hai Xu, distinguished engineer