Cooler Master Assigned Patent

Cooler Master Co., Ltd., Taipei, Taiwan, has been assigned a patent (12369276) developed by Chen; Bo-Zhang, and Cheng; Jen-Chih, Taipei, Taiwan, for “storage assembly and heat dissipation device.“

The abstract of the patent published by the U.S. Patent and Trademark Office states: “A storage assembly includes a heat dissipation device and a storage. The heat dissipation device includes a thermally conductive block, a heat sink and a plurality of heat pipes. An end of each of the heat pipes is thermally coupled with the thermally conductive block, and another end of each of the heat pipes is thermally coupled with the heat sink. The storage is thermally coupled with the thermally conductive block.”

The patent application was filed on 2023-06-08 (18/207653).