Kioxia Sampling UFS V. 4.1 Up to 1TB Embedded Flash Memory Devices with 8th Gen BiCS FLASH

Kioxia Corporation announced that it has begun sampling new Universal Flash Storage ⁽²⁾ (UFS) Ver. 4.1 embedded memory devices, reinforcing its leadership in high-performance storage.

Engineered to meet the demands of next-gen mobile applications, including advanced smartphones with on-device AI, the new devices offer improved performance with greater power efficiency ⁽³⁾, in a small BGA package.

UFS Ver. 4.1 devices from Kioxia integrate the company’s BiCS FLASH 3D flash memory and a controller in a JEDEC-standard package. These new UFS devices are built with the firm’s 8th Gen BiCS FLASH 3D flash memory ⁽¹⁾. This generation introduces CBA (CMOS directly Bonded to Array) technology – an architectural innovation that marks a step-change in flash memory design. By directly bonding the CMOS circuitry to the memory array, CBA technology enables major gains in power efficiency, performance and density.

With a blend of speed and low power use, Kioxia’s UFS Ver. 4.1 devices are built to enhance user experiences – enabling faster downloads and smoother app performance.

Key Features include:

• Available in capacities of 256GB, 512GB and 1TB
• Performance improvement over previous-gen ⁽³⁾:
  • Random writes: 512GB / 1TB approx. +30%
  • Random reads: 512GB approx. +45%, 1TB approx. +35%
• Power efficiency improvement over previous generation ⁽³⁾:
  • Reads: 512GB / 1TB approx. +15% improvement
  • Writes: 512GB / 1TB approx. +20% improvement
• Host Initiated Defragmentation enables delayed garbage collection for uninterrupted fast performance during critical times
• WriteBooster buffer resizing provides better flexibility for optimal performance
• Support of the UFS Ver. 4.1 standard
• Reduced package height for the 1TB model compared to the prior-gen ⁽⁴⁾
• Uses Kioxia’s 8th Gen BiCS FLASH 3D flash memory ⁽¹⁾

UFS 4.0/4.1 Specs:

⁽¹⁾ 512GB / 1TB models only.
⁽²⁾ Universal Flash Storage (UFS) is a product category for a class of embedded memory products built to the JEDEC UFS standard specification. Due to its serial interface, UFS supports full duplexing, which enables both concurrent reading and writing between the host processor and UFS device.
⁽³⁾ Compared to the previous generation 512GB device ‘THGJFMT2E46BATV’ and 1TB device ‘THGJFMT3E86BATZ’ respectively (512GB / 1TB models only).
⁽⁴⁾ The previous-gen 1TB device ‘THGJFMT3E86BATZ’.