Samples of Primemas CXL Memory 3.0 SoC are Available

Primemas Inc., fabless semiconductor company specializing in chiplet-based SoC solutions through its Hublet architecture, announced the availability of customer samples of a 1st Compute Express Link (CXL) memory 3.0 controller.

The company has been delivering engineering samples and development boards to select strategic customers and partners, who have played a key role in validating the performance and capabilities of Hublet compared to alternative CXL controllers. Building on this successful early engagement, Primemas is announce that Hublet product samples are ready for shipment to memory vendors, customers, and ecosystem partners.

While conventional CXL memory expansion controllers are limited by fixed form factors and capped DRAM capacities, Primemas leverages cutting-edge chiplet technology to deliver unmatched scalability and modularity. At the core of this innovation is the Hublet – a versatile building block that enables a wide variety of configurations.

Company’s customers are finding innovative ways to leverage the modularity:

• 1×1 single Hublet delivers compact E3.S products supporting up to 512GB of DRAM;
• 2×2 Hublet can support a PCIe Add-in-card or CEM products with up to 2TB of DRAM, and
• For hyperscale environments, a 4×4 Hublet powers a 1U rack memory appliance capable of an impressive 8TB of DRAM.

“We are very encouraged by the excellent feedback from our initial partners, who leveraged Hublet to address the challenges posed by rapidly growing workloads,” said Jay Kim, EVP and head, business development, Primemas. “We’re excited to take the next major step toward commercialization through our collaboration with Micron and their CXL AVL program.”

The CXL ASIC Validation Lab (AVL) program was established by Micron Technology, Inc. to help bring next-gen CXL controllers to market and achieve maximum reliability and compatibility with its advanced DRAM modules. There are numerous challenges to delivering stable, reliable memory RW operations while optimizing performance and power efficiency in CXL controllers. Through this joint effort, the 2 companies aim to provide a high-quality, reliable and the world’s first CXL 3.0 controller along with the latest high-capacity 128GB RDIMM modules.

“With the rapid adoption of AI, and the corresponding increase in memory-intensive workloads, CXL-based solutions are driving innovations to transform traditional compute platforms,” said Luis Ancajas, director, CXL business development, Micron. “As an industry leader in data center memory solutions, we are excited to collaborate with innovators like Primemas to validate and accelerate next-generation solutions like the Hublet SoC through our AVL program and help bring these transformative solutions to market to unlock new levels of performance, scalability and efficiency for the data center.”

This joint effort demonstrates the shared commitment of Primemas and Micron to innovation and quality in the semiconductor industry and further strengthens Primemas’ position as a leader in scalable, high-performance chiplet-based SoC solutions for CXL, AI, and data analytics applications.