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R&D: Advances in Resistive Switching Memory, Comprehensive Insights into ECM Mechanisms through TEM Observations and Analysis

Observation of filament formation via TEM facilitates atomic-resolution investigations into real-time evolution of nanostructures within resistive switching memory systems.

Materials Advances has published an article written by Woonbae Sohn, Metropolitan Seoul Center, Korean Basic Science Institute, Seoul, 02855, Republic of Korea, Hyerim Kim, School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, 16419, Republic of Korea, Jung Hun Lee, Department of Materials Science and Engineering and the Materials Research Center, Northwestern Universiy, Evanston, IL 60208, USA, Young-Seok Shim, School of Energy, Materials and Chemical Engineering, Korea University of Technology and Education, Cheonan, 31253, Republic of Korea, Cheon Woo Moon, Department of Display Materials Engineering, Soonchunhyang University, Asan, 31538, Republic of Korea, and Hyojung Kim, Department of Semiconductor Systems Engineering, Sejong University, Seoul, 05006, Republic of Korea.

Abstract: The information age requires improved devices, especially performance and output, due to data processing, power consumption, flexibility, multifunctionality, cost efficiency, and fabrication technologies. Examining resistive switching properties indicated that the conductive filament mechanism and the movement of ions from dielectric layers or electrodes play a crucial role in facilitating resistive switching. Despite extensive studies employing various materials to clarify the resistance switching in memory devices, the fundamental mechanisms still need to be more adequately understood. In ECM, metal cations move from a top electrode that shows electrochemical activity, creating conductive metal filaments. The complex nature of ion migration at the nanoscale and the associated redox reaction in resistive switching require a thorough understanding through transmission electron microscopy (TEM). In situ TEM enables the real-time observation of resistive switching dynamics, highlighting the limitations of static ex situ TEM. The observation of filament formation via TEM facilitates atomic-resolution investigations into the real-time evolution of nanostructures within resistive switching memory systems. Understanding resistive switching behavior may improve the performance and reliability of memory devices. This assessment can be gained from applying electrodes featuring resistive switching material systems for ECM, which aim to advance the development of universal nonvolatile memory devices.“

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