Flash Memory Summit: Advantest to Showcase Memory and SSD System-Level Test Solutions

At Flash Memory Summit 2023, Advantest Corp. will showcase its latest storage and memory test solutions on August 8-10 at the Santa Clara Convention Center in Santa Clara, CA.

MPT3000HVM test system

The company is again a gold sponsor of this year’s event.

Featured products
At its booth, the company will feature the MPT3000HVM3 test system that addresses test requirements associated with PCIe Gen 5, Compute Express Link (CXL) and NVMe SSDs. Its latest innovation, the HVM3, provides capabilities to handle virtually any SSD, from the highest-performing enterprise drives to the most cost-effective client devices.

T5835 test solution

The firm will also exhibit its all-in-one NAND test solution, the T5835, as well as the T5503HS2, a DRAM tester for LPDDR5/X, DDR5 and GDDR6 devices. Additionally, the company will display its inteXcell, the first-ever fully integrated and unified test infrastructure to combine broad test coverage with high-throughput handling. The platform integrates the T5835 tester with minimal-footprint test cells for high-speed, parallel final test of up to 1,536 advanced memory ICs.

Independent Thermal Control (ITC) device interface board

Two additions to the firm’s lineup this year are the Independent Thermal Control (ITC) device interface board and the Engineering Thermal Chamber (ETC) for the MPT3000.

Engineering Thermal Chamber (ETC)

Both provide QA and R&D teams with advanced, accurate thermal control on a per-DUT level during device characterization or small lot production testing, helping QA and engineering teams to characterize and qualify Gen 5 products, including SSDs and CXL memory solutions. Both extend MPT3000’s feature set to a wider set of use cases.