Flash Memory Summit: Advantest Rolls Out Thermal Control Products for MPT3000 SSD Test Platform

Advantest Corporation announced 2 additions to its MPT3000 SSD test platform.

Engineering Thermal Chamber

The Independent Thermal Control (ITC) device interface boards (DIBs) and Engineering Thermal Chamber (ETC) target early engineering adoption of the MPT3000 by enabling efficient, small-batch engineering, quality assurance and early test development for SSD devices.

Advanced computing standards, such as PCIe Gen 5, enable higher-speed SSD devices with expanded bandwidth for use in advanced data centers and other demanding storage applications. These faster, higher-capacity devices must be characterized and tested in thermal environments that accurately replicate operating temperatures.

Designed for device test qualification and validation, the ETC is integrated into the MPT3000ES3 test system to handle the highest-power PCIe Gen 5 DUTs. The unit enables accurate environmental temperature control within the chamber from -10°C to 85°C, utilizing air flow to accurately condition up to 32 4-lane DUTs. The ETC is for characterizing small batches of DUTs at a set temperature within the range stated.

Independent Thermal Control device interface boards

Created for high-volume production test and qualification, the MPT3000HVM3 test systems support ITC DIBs, allowing the user to accurately set and maintain a constant drive temperature. Using active temperature feedback from the DUT, the fan speed is controlled to maintain a constant DUT temperature. This is an improvement from standard DIBs, which supply constant cooling air and allow the DUT temperature to fluctuate with the wattage of the test cycle. ITC DIBs feature air channels on either side of the DUT to maintain a constant DUT temperature on all DUTs, even during asynchronous testing cycles.

“Our customers increasingly need an easy-to-implement solution for engineering, quality assurance and early test development on their SSD devices to ensure they will operate reliably, at temperature, in their end environments,” said Indira Joshi, VP, MPT3000 product line. “With these new products for our proven MPT3000 test platform, users can execute all of these tasks efficiently, in small batches, for greater flexibility at test, qualification and validation.”

Customer deliveries are currently underway for the Engineering Thermal Chamber and Independent Thermal Control device interface boards. These products are expected to be available for customer purchase in 4CQ23.

To learn more about these products, as well as the company’s portfolio of memory test and measurement systems, visit the firm’s booth at Flash Memory Summit 2023, August 8-10, Santa Clara Convention Center, Santa Clara, CA.