Toshiba Ships Samples of Universal Flash Devices Up to 64GB

Toshiba Corporation and Toshiba America Electronic Components, Inc., (TAEC) began shipping samples of its 64GB embedded NAND flash memory module equipped with a Universal Flash Storage (UFS) interface.

The first in the industry [For embedded NAND flash memory modules. Source: Toshiba, as of February 2013], the new module is compliant with the JEDEC UFS Ver.1.1 standard, and is designed for a range of digital consumer products – including smartphones and tablet PCs.

With improved data processing speeds in host chipsets and wider bandwidths for wireless connectivity, demand continues to grow for large density, high-performance memory that supports high resolution video.

Samples are mainly intended for evaluation of the UFS interface and its protocol in host chipsets and by OS vendors. Toshiba will schedule mass production of the 64GB UFS module, as well as other densities in its lineup, according to market demand.

Product

• Part Number: THGLF0G9B8JBAIE
• Density: 64GB    
• Package: 169Ball FBGA, 12x16x1.2mm    
• Sample shipment: January 2013

Key Features
The JEDEC UFS Ver.1.1 compliant interface handles essential functions, including writing block management, error correction and driver software. It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products.

UFS has a serial interface and scalability in terms of number of lanes and speed.

The new products are sealed in a small FBGA package, 12x16x1.2mm and have a signal layout compliant with JEDECUFS Ver.1.1.

Specs

• Interface: JEDEC UFS Version 1.1 standard
• Power Supply Voltage: 2.7V to 3.6V (Memory core) – 1.70V to 1.95V（Controller core）- 1.10V to 1.30V (UFS I/F signals)
• Number of lanes: Downstream 1 lane / Upstream 1 lane
• Interface Speed: 2.9Gbps/lane
• Temperature range: -25°C to +85°C
• Package: 169Ball 12x16x1.2mm FBGA