GlobalFoundries Reaches Agreement to Establish US-Based Supply of Silicon Interposers for Advanced AI Packaging

GlobalFoundries announced a manufacturing agreement with TSMC to establish US-based supply of silicon interposers for TSMC’s CoWoS advanced packaging ecosystem.Under the agreement, GF will provide manufacturing service to TSMC, and add fabrication capacity at its Malta, New York facility, supporting growing demand for high-performance computing and AI systems. The agreement provides a foundation to expand capacity over time as customer demand grows.

GF expects to expand capacity at its Malta facility and establish the first US-based source of silicon interposers supporting advanced packaging technologies, including embedded deep trench capacitor components. The additional manufacturing capacity will provide greater scale and flexibility for delivering advanced packaging solutions across multiple product generations.

“Advanced packaging is becoming increasingly critical to delivering the performance, power efficiency and scale required for next-gen AI systems,” said Ed Kaste, SVP, CMOS Business, GF. “By providing manufacturing service using GF’s trusted US manufacturing footprint, we are creating a secure, scalable source of essential advanced-packaging elements that will help customers accelerate innovation and strengthen the semiconductor supply chain.”

Volume production is expected to begin ramping at GF’s Malta site during the first half of 2028. The agreement has an initial term of five years and provides a framework for future capacity expansion.