MWC 2026: Biwin Showcases Cutting-Edge Storage Solutions

Addressing the rapidly evolving storage demands of AI-driven and data-intensive applications in 5G/6G base stations, enterprise data centers, and customer-premises equipment (CPE).

Biwin Storage Technology Co., Ltd., showcases its latest advancements in embedded memory, automotive, industrial, and enterprise-grade storage at MWC 2026, booth CS104, March 2nd to 5th, in Barcelona, Spain.

As the world’s premier exhibition and conference for the mobile communications industry, MWC 2026 brings together manufacturers, network operators, technology leaders, policymakers, and global media.

ePoP5x

Biwin ePoP5x enables the future of AI-enabled devices with 0.54mm thinness defining the current state-of-the-art for wearables. It can be mounted directly on the main SoC, enabling ultra-thin and lightweight system designs. With flexible capacity options of 64GB + 2GB/3GB/4GB, it strikes an optimal balance between compact size and exceptional performance. Built to withstand the rigorous demands, the ePoP5x undergoes stringent reliability validation and full-process quality traceability, delivering resilience to drops and long-term wear encountered in wearables. This establishes a solid foundation for the large-scale deployment of AI AR glasses, smartwatches, and new AI devices.

The company’s ePoP5x can be mounted directly on the main SoC, enabling ultra-thin and lightweight system designs. With flexible capacity options of 64GB + 2GB/3GB/4GB, it strikes an optimal balance between compact size and performance.

Built to withstand the rigorous demands, the ePoP5x undergoes stringent reliability validation and full-process quality traceability, delivering resilience to drops and long-term wear encountered in wearables. This establishes a solid foundation for the large-scale deployment of AI-AR glasses, smartwatches, and new AI devices.

Redefining Mobile Storage with Fast, Compact, High-Speed Solutions :

Mini SSD: Faster Speed, More Capacity for Smaller Next Gen Devices

Named to TIME’s list of Best Inventions of 2025, Mini SSD represents a breakthrough in storage design, using LGA packaging technology to integrate the controller and flash memory into a super-compact form factor – the size of a small coin.

Measuring just 15.0 × 17.0 × 1.4 mm, this next-gen SSD can deliver read speeds of up to 3700 MB/s and write speeds of up to 3,400MB/s. With IP68-rated dust and water resistance and the ability to withstand drops up to 3 meters, the Mini SSD meets the rigorous demand for size, speed and performance in industrial environments, mobile devices, and edge computing applications.

Enhancing Data Management and Storage Efficiency for Enterprises

Biwin SP506/516 PCIe Gen 5 SSD:

For enterprises seeking high-capacity, high-speed storage solutions, the SP506/516 series uses the PCIe Gen5x4 interface and offers double the bandwidth of PCIe Gen 4. With capacities ranging from 2 to 16TB, these drives are built to meet the growing demands of next-generation data centers, AI applications, and cloud computing.

Featuring advanced security features like AES256 encryption, Secure Boot, and E2E Data Protection, the SP506/516 series ensures the highest standards of data protection and reliability.

Delivering Reliable Storage for Industrial, Automotive Applications

Biwin TGS200 Wide-Temp SSDs Series:

The TGS201 SSD features a 2.5-inch SATA 3 form factor, while the Biwin TGS205-P SSD adopts a compact M.2 2242 SATA 3 design, ideal for space-constrained industrial systems. The TGS203 SATA SSD offers a balanced combination of capacity and performance in a M.2 2280 form factor. All 3 models deliver sequential RW speeds of up to 560MB/s and 510MB/s, and operate reliably across an extended temperature range of -40°C to +85°C, ensuring consistent performance in harsh and demanding environments.

The TGS200 Series is equipped with power-loss protection, safeguarding data against damage from unexpected power outages. Customization options, including conformal coating, sidefill/underfill and anti-sulfuration, provide choices of additional solutions to enhance reliability and durability in harsh environments.

Designed for industrial-grade reliability, the TGS200 Series integrates industrial-grade controllers and TLC NAND flash to support long-term, stable operation. The series is well suited for mission-critical applications such as industrial automation, rail transportation, metro gate systems, and 5G communication base stations, where durability and dependable performance are essential.

TAU208 UFS 3.1:

The TAU208 is a high-performance UFS 3.1 storage solution engineered for data-intensive smart vehicles. It delivers speed with 23.2Gb/s bandwidth (2,150MB/s read), ensuring real-time processing for HD maps and autonomous driving streams. Built for reliability, it is AEC-Q100 compliant, operating flawlessly between -40°C and 105°C with robust LDPC and RAIN data protection. Its ultra-slim profile (as thin as 1.0mm) ensures easy integration, while an advanced Deep Sleep mode cuts power consumption by 95%, making it highly efficient for modern electric vehicle architectures.

The TAU208 masters the critical balance between extreme performance and energy efficiency required by the software-defined vehicle era. As automakers race to optimize EV range, the TAU208’s 95% power reduction in sleep mode solves a major parasitic drain issue. Simultaneously, its server-grade speed (300K IOs) and ability to withstand extreme thermal shock (-40°C to 105°C) provide the unshakeable reliability needed for safety-critical ADAS. It is not just storage; it is a foundational enabler for the next generation of autonomous driving.