Montage Technology Completed its IPO

Montage Technology, an IC design company focused on high-performance, low-power solutions for cloud computing and data center markets, completed its IPO on Monday, February 12, 2026, on the Hong Kong Stock Exchange.The offering is expected to raise HK$7.04 billion (approximately US$900 million). Shares were priced at HK$106.89 and opened at HK$168, climbing as high as HK$176 during the trading session. At the time of writing, the stock is trading at around HK$185, after reaching an intraday high of HK$188.

This strong performance underscores robust market demand for data center memory interface solutions and chips, driven by the accelerating adoption of artificial intelligence.