AP Memory Broadens S-SiCap Technology Deployment to Support Evolving AI and HPC Needs

AP Memory Technology Corp., company providing customized memory solutions, announced further advancements in its S-SiCap (Stack Silicon Capacitor) product line to address the increasing integration demands of AI servers and HPC systems. The S-SiCap portfolio includes 2 product categories – discrete silicon capacitors and interposers with silicon capacitors – designed to support different system architectures and diverse application requirements.

The discrete silicon capacitors, S-SiCap Gen4, achieves a capacitance density of 3.8μF/mm², an increase of more than 50% over the previous-gen. To meet the growing demand for higher performance and power efficiency in AI servers and HPC systems, S-SiCap Gen4 is the 1st to adopt embedded substrate packaging and is currently in the sampling and process validation stage. Mass production will be introduced progressively starting in 2026.

Meanwhile, the S-SiCap Interposer utilizes a silicon wafer as its substrate, embedding high-density silicon capacitors within the interposer. This significantly enhances signal integrity and power stability for high-speed I/O applications such as die-to-die, SerDes, and HBM. In collaboration with supply-chain partners, AP Memory has introduced a reticle-stitching technology to enlarge interposer die area allowing more IC chiplets to meet the growing demand for higher-integration advanced packaging solutions. The S-SiCap Interposer has completed customer packaging and reliability validation, entering 4-reticle mass production at the end of Q3’25. Additional development projects are currently underway.

Ivan Hong, president, AP Memory, stated, “As AI and HPC applications continue to evolve rapidly, the industry is facing increasingly stringent requirements for power integrity and high-speed signal transmission. Through the S-SiCap product line, AP Memory delivers silicon capacitor technology in both discrete components and interposer-integrated forms, providing high performance, high integration, and design flexibility to meet the demands of next-generation AI and HPC systems.” Looking ahead, AP Memory is actively developing silicon capacitor solutions for organic interposer architectures, further expanding its product portfolio.”