Anaflash Advances Embedded Flash Memory for Next-Gen Smart Edge Devices with Samsung Foundry

Anaflash has developed an AI MCU with its proprietary standard logic compatible embedded flash technology using Samsung Foundry’s 28nm process.

This breakthrough enables the integration of zero-standby-power weight memory based on the company’s Logic-EFLASH technology, utilizing only standard logic devices. The result is a cost-effective and energy-efficient AI MCU designed for battery-powered smart edge devices.

“Supporting startups like Anaflash reflects Samsung Electronics’ commitment to expanding the versatile silicon manufacturing ecosystem with innovative technologies,” said Margaret Han, EVP and head of US foundry, Samsung Electronics. “We look forward to continuing our collaboration with Anaflash to advance a cost-effective way to integrate the nonvolatile memory technology in our advanced logic processes, unlocking new possibilities of intelligent edge computing.”

Anaflash’s collaboration with Samsung Electronics originated through its wholly owned subsidiary in Korea, SEMIBRAIN, the inaugural winner of the fabless challenge contest that the company sponsored in 2022. Since then, multiple research grants were awarded by government funding agencies in Korea to further develop its Logic-EFLASH technology using Samsung Foundry and build a cost and energy efficient AI MCU based on the tightly coupled weight memory technology.

“The support from Samsung enabled us to prove our Logic-EFLASH technology for the first time using high-k and metal-gate technology,” said Younghee Jeon, head, Korea research center, Anaflash. “This achievement demonstrates how AI computation can be accelerated efficiently tightly coupled with the zero-standby power weight memory, and we will continue accelerating our innovation in the more advanced process nodes.”

The AI MCU built using a 28nm process from Samsung Foundry also features a 4-bits/cell embedded flash technology demonstration to store a trained AI model efficiently.

Anaflash will present its AI MCU architecture with the tightly coupled weight memory at the IEEE Asian Solid-State Circuits Conference, taking place on November 2-5, 2025 in Daejeon, Korea.

Availability:
The company’s AI MCU is currently sampled to the partners and customers with supporting software development packages.