Weebit Nano Tapes out Embedded ReRAM Test Chips at Onsemi Production Fab

Weebit Nano Ltd. has successfully taped-out (released to manufacturing) test chips featuring its embedded Resistive Random-Access Memory (ReRAM) module at onsemi’s 300mm production fab in East Fishkill, NY. The chips are being developed in onsemi’s Treo platform, which is a 65nm Bipolar-CMOS-DMOS (BCD) process. onsemi is a U.S. based company that delivers intelligent power and sensing solutions for the automotive, industrial and AI data center markets.

This tape-out represents a key milestone towards enabling Weebit ReRAM IP on onsemi’s Treo platform. For Treo-based designs, Weebit ReRAM provides an ultra-low-power, high density NVM that unlocks new levels of intelligence and functionality. onsemi’s next-generation products are expected to use this breakthrough memory technology. The test chips will now be used for final testing and qualification ahead of anticipated volume production.

Coby Hanoch, CEO, Weebit Nano, said: “Our collaboration with onsemi is progressing rapidly, and this successful tape-out marks a major milestone in completing the technology transfer of Weebit ReRAM to onsemi’s advanced BCD process. We’ve already validated our technology on multiple wafer lots using onsemi’s tools and flow, optimising the process and demonstrating solid performance and reliability. We’re now progressing towards qualification.”