FS Introduces Future-Ready 200G Switch Solution for AI Storage and 400G Migration

FS, Inc., provider of ICT products and solutions, highlights the N8550-24CD8D, a future-ready 200G switch widely adopted in AI storage and evolving data center deployments.

Purpose-built for hybrid infrastructure upgrades and AI workloads, the switch delivers high throughput, flexible port design, and scalability to support next-gen networking demands.

As enterprises and service providers face growing AI workloads and the need for faster, lossless data transport, many are upgrading from 100 or 200G to 400G architectures. The N8550-24CD8D plays a critical role in this transition – serving as a high-density access switch for 100/200G AI storage networks while integrating into 400G spine-leaf topologies via uplinks to FS 400G spine switches. This flexible deployment model enables cost-effective scaling and ensures consistent, low-latency performance for demanding AI and cloud applications.

Designed for mid-to-large scale data centers, the N8550-24CD8D is a high-density leaf switch featuring 24×200G ports with breakout options to 2×100G or 4×50G, ensuring backward compatibility and flexible access. In 400G spine-leaf network upgrade scenarios, it provides 8×400G uplinks to connect with FS’s 400G spine switches such as the N9550-32D or N9550-64D, enabling scalable and smooth migration to full 400G fabrics with advanced protocols like EVPN-VXLAN and MLAG for multi-tenant environments. In AI storage network architectures, the switch acts as a critical aggregation leaf, connecting compute and storage nodes with low-latency, lossless performance by leveraging RoCEv2, PFC, and ECN. Powered by the Broadcom Trident 4 chip and large buffers, the switch ensures low-latency, high-throughput performance for demanding AI workloads. Its flexible port configuration also supports compact aggregation scenarios requiring high-density connectivity.

N8550-24CD8D switch front and rear

Key Features of FS N8550-24CD8D 200G Switch:

• Broadcom BCM56780 Trident 4-X9 Chip, 8Tb/s Throughput

• 24x200GbE QSFP56, Can Use Breakout for 2x100GbE or 4x50GbE

• PicOS Supports MLAG, EVPN-VXLAN, RoCEv2, PFC, ECN and DLB

• AmpCon-DC Management Platform Provides Full Day 0 to Day 2+ Capabilities

• Designed for Data Center Fabric Spine/Leaf

Jaylnn He, senior manager, product R&D, FS, stated: “FS is committed to delivering fully optimized network solutions for HPC data centers. With extensive experience in 400G/800G InfiniBand and RoCE-based architectures, we have launched the high-density, low-latency N8550-24CD8D switch. This product exemplifies our dedication to providing leaf solutions that enable seamless 400G network upgrades and robust AI storage network aggregation. With its advanced features and flexible design, the N8550-24CD8D empowers our customers to build scalable, efficient, and future-proof data center fabrics.”