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Computex 2025: Storage Meets AI, Longsys to Showcase Storage Solutions Built for AI-era Applications

Including XP2350 next-gen QLC NAND SSD, new industrial-grade BGA SSD, and Lexar NM1090 PRO PCIe Gen5 consumer SSD

Longsys Electronics Co., Ltd. will exhibit at Computex 2025, Taipei, Taiwan, from May 20 to 23 at Taipei Nangang Exhibition Center, under the theme Storage Meets AI.

Longsys Computex2025 Intro

 

As AI continues to drive innovation across devices and infrastructure, the company will unveil a portfolio of high-performance, high-capacity, and highly reliable storage solutions built for AI-era applications.

As AI models grow in size and are increasingly deployed locally, they require vast storage with strong throughput capabilities. This drives the demand for QLC NAND SSDs, which offer higher capacity at a lower cost compared to TLC and MLC. The firm will debut the XP2350, a next-gen QLC NAND SSD engineered to meet the demands of large AI models and read-intensive tasks such as inference, GenAI, and ML. With superior storage density and cost-efficiency, the XP2350 QLC NAND SSD is optimized for fast local access to massive datasets.

To meet the growing demand for compact and robust storage in industrial application, the company will introduce a new industrial-grade BGA SSD. This solution delivers high performance and long-term reliability in space-constrained environments, making it ideal for rugged tablets, embedded systems, and industrial PCs. Compared to consumer-grade BGA SSDs, it offers enhanced endurance and stability, expanding the firm’s industrial storage portfolio.

In the consumer application, Lexar Co. Ltd., Longsys’s high-end consumer storage brand, will showcase the NM1090 PRO PCIe Gen5 SSD, which doubles the speed of Gen4 SSDs. This flagship model is built to deliver top-tier performance for demanding creators, gamers, and professionals.

In addition to the XP2350 QLC NAND SSD, the firm will showcase a broader portfolio of AI-oriented storage innovations. These include QLC-based eMMC solutions optimized for mobile devices, offering higher storage density and lower power consumption to support next-gen on-device AI in consumer electronics. The company will also feature enterprise-grade SSDs and DRAM designed for AI data centers, delivering the performance and reliability required for localized AI deployment.

Longsys will also present its PTM (Product Technology Manufacturing) model – an end-to-end storage foundry service that integrates chip design, firmware development, packaging, industrial design, testing, and manufacturing. This full-stack service enables customizable storage solutions across AI PCs, servers, smartphones, and data centers.

With the convergence of AI and storage accelerating, the company is committed to empowering intelligent transformation with innovative products and solutions.

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