OFC 2025: Broadcom Advances Optical Connectivity for AI Infrastructure

Broadcom Inc. announced the expansion of its portfolio of optical interconnect solutions to enable AI infrastructure.

These innovative technologies, including advancements in co-packaged optics (CPO), 200G/lane DSP and SerDes, 400G optics, and PCIe Gen6 over optics, have been announced at the 2025 Optical Fiber Communications Conference and Exhibition (OFC). The company’s demonstrations highlight the firm’s roadmap towards 200T optical interconnect solutions.

AI workloads are rapidly increasing, driving the need for higher bandwidth, lower latency, and more power-efficient optical interconnects. Broadcom is meeting these evolving demands with a portfolio of innovative solutions designed to support the growth and scalability of AI clusters. These solutions include low-power, high-bandwidth DSP, SerDes and CPO for reduced power consumption and improved signal integrity, and PCIe Gen6 over optics for enhanced connectivity between AI accelerators and other system components.

At OFC, the company is showcasing wide range of novel technologies underscoring our commitment to developing cutting-edge solutions for AI infrastructure:

XPU-CPO: Industry’s first 6.4-Tb/s optics attach for custom AI accelerator (XPU) enabling high bandwidth, long reach scale-up fabric connectivity for AI servers.
Sian3: State-of-the-art 3nm 200G/lane DSP delivering industry’s lowest power consumption with enhanced performance for 800G and 1.6T optical transceivers over SMF.
Sian2M: Industry’s first 200G/lane DSP with integrated VCSEL drivers enabling low power, short reach MMF links in AI clusters.
200G/lane Lasers: Leading-edge 200G VCSEL, EML and CWL technologies facilitating high speed interconnects for front-end and back-end networks of large-scale AI clusters.
400G EML: Industry’s first demonstration of 400G EML technology for next-generation AI optical interconnects.
PCIe Gen6 over Optics: Industry’s first demonstration of PCIe Gen6 optical connectivity for AI scale-up fabric using Broadcom’s 100G VCSEL and photodetector.
LPO / BCM957608 NIC: Industry-leading 400G PCIe Ethernet NIC connecting with LPO module to enable scalable AI networks with high performance and efficiency.
Co-Packaged and Near-Packaged Copper: State-of-the-art 200G/lane copper link solutions enabling cost-effective, high-bandwidth connectivity in emerging AI architectures.
7m+ AEC for 800G: Industry’s first 800G AEC retimer solution extending DAC cable reach beyond 7 meters.

“OFC’s 50th anniversary provides the opportunity to recognize the industry’s many achievements, including Broadcom’s industry-first contributions to this field,” said Charlie Kawwas, Ph. D., president, semiconductor solutions group, Broadcom. “A year ago, Broadcom committed to pushing technical boundaries to pioneer new open, scalable and power-efficient technologies to enable AI infrastructure. Our portfolio of optical interconnect solutions, highlighted at OFC 2025, paves the way to 200T by addressing the performance, power, and scalability challenges of AI clusters.”

In addition, Broadcom is collaborating with more than 15 partners to demonstrate a wide array of its industry-leading solutions across the show floor. Throughout the conference, the company is speaking on the technical challenges and advancements in optical networking and communications.

Resource:
Blog: Ahead of OFC: Broadcom’s progress towards scaling Co-Packaged Optics