FMS 2024: NEO Semiconductor Wins Award

NEO Semiconductor announced that its technology, 3D X-AI, captured the top prize at FMS: The Future of Memory and Storage 2024, winning the “Best of Show” award for the Most Innovative Artificial Intelligence Application.

This category recognizes how a product or service that includes all forms of high-performance memory or storage is being used to solve a specific AI problem, and also includes the use of AI in storage and memory products, or potentially in a product that accelerates AI tasks.

“In order to enable emerging and future AI use cases, AI solutions demand AI chips that can deliver higher performance, greater scalability and neural network efficiencies,” said Jay Kramer, chairman of the awards program and president of Network Storage Advisors Inc. “We are proud to recognize NEO Semiconductor’s 3D X-AI as the world’s first 3D memory with AI processing, which accelerates neural performance by 100X and reduces power consumption by 99%.”

“Today we announced a novel architecture: AI Processing in 3D Memory. NEO’s 3D X-AI chip will allow the data of large models to be processed inside the memory, so it dramatically increases the AI performance and reduces the power consumption,” said Andy Hsu, founder and CEO, NEO Semiconductor. “We are honored and thankful to accept this prestigious award, and I applaud the entire NEO Semiconductor team for the hard work and dedication it has taken to make this ground-breaking technology a reality.”