HPE Discover 2024: SK hynix Showcasing AI Memory and SSDs Solutions

SK hynix Inc has returned to Las Vegas, NV, to showcase its AI memory solutions at HPE Discover 2024, Hewlett Packard Enterprise’s annual technology conference.

Held from June 17–20, HPE Discover 2024 featured a packed schedule with more than 150 live demonstrations, as well as technical sessions, exhibitions, and more. This year, attendees could also benefit from 3 new curated programs on edge computing and networking, hybrid cloud technology, and AI.

Under the slogan ‘Memory, The Power of AI,’ SK hynix was displaying its latest memory solutions at the event including those supplied to HPE. The company was also taking advantage of the numerous networking opportunities to strengthen its relationship with the host company and its other partners.

Memory solutions driving AI
The company’s booth at HPE Discover 2024 consisted of 3 product sections and a demonstration zone which showcase the capabilities of its AI memory solutions.

AI memory solutions on display including HBM3E and CMM-DDR5

The first section featured the company’s memory solutions for AI, including HBM ⁽¹⁾ solutions. In particular, the HBM3E has emerged as a core product to meet the growing demands of AI systems due to its processing speed, capacity, and heat dissipation. A key solution from the company’s CXL⁽²⁾ lineup, CXL Memory Module-DDR5 ⁽³⁾ (CMM-DDR5), was also on display in this section. In the AI era where high performance and capacity are vital, CMM-DDR5 has gained attention for its ability to expand system bandwidth by up to 50% and capacity by up to 100% compared to systems only equipped with DDR5 DRAM.

Server DRAM products are optimized for AI computing

In the 2nd section of the booth, the company was presenting its leading server DRAM solutions. The company’s power-efficient and rapid DDR5 RDIMM ⁽⁴⁾ and MCR DIMM ⁽⁵⁾ were featured, showcasing their ability to support AI computing in high-performance servers. Equipped with 1bnm, the 5th generation of the 10nm process technology, DDR5 RDIMM can reach speeds of up to 6,400Mb/s, while MCR DIMM boasts speeds of up to 8,800Mb/s. Additionally, the firm was displaying its LPCAMM2 ⁽⁶⁾, a module solution that is increasingly being applied in AI PCs due to its low-power and high-performance features.

SSD portfolio including products supplied to HPE

Visitors could also see some of the company’s latest enterprise SSDs (eSSD) in the 3rd section of the booth. These include the PCle Gen5-based PS1010 and PS1030, which are recognized to be ideal for AI, big data, and ML applications due to their rapid sequential read speeds. Within the same section, the firm’s U.S. subsidiary Solidigm was presenting its QLC ⁽⁷⁾– based eSSDs such as D5-P5430, D5-P5316, and D5-P5336. Offering industry performance and massive capacity, these products will serve as optimal solutions for various customers that require immense storage space.

Sharing latest innovations and trends in AI Memory
The company hosted sessions on how its memory solutions are fueling innovation in AI.

During the presentation sessions at the conference, the firm held talks that focused on how the company’s memory products are fueling innovation in AI. On June 18, Brian Yoon, technical leader, DRAM technology planning, SK hynix America provided an overview of CXL and discussed enabling memory expansion with CMM-DDR5. Yoon also touched on the features of HMSDK ⁽⁸⁾, a software that supports CMM-DDR5. Hours later, Santosh Kumar, director, NAND technology planning, SK hynix America and Seonjae Kim, technical leader, SSD enablement, SK hynix covered SSD technology trends and how SK hynix and Solidigm can meet future SSD demands. During the talk, the pair shared how the companies’ SSD products are optimized for AI storage and modern data center workloads.

Embracing memory community to power future of AI
At HPE Discover 2024, SK hynix has underlined how it is spearheading innovations in the AI memory sector. The event is a chance for the company to showcase its industry-leading solutions, and also a time to strengthen its partnership with HPE and other industry players.

“SK hynix is maintaining a close partnership with HPE based on its industry-leading memory technology, including securing contracts to supply high-capacity DDR5 and 16-channel Gen5 eSSD products,” said Myoungsoo Park, VP, head of US/EU sales, SK hynix. “We will continue to strengthen our cooperation with global partners to further solidify our technological leadership as the world’s number one AI memory provider.”

⁽¹⁾ High Bandwidth Memory (HBM): A high-value, high-performance product that revolutionizes data processing speeds by connecting multiple DRAM chips with through-silicon via (TSV).
⁽²⁾ Compute Express Link (CXL): A PCIe-based next-generation interconnect protocol on which high-performance computing systems are based.
⁽³⁾ Double Data Rate 5 (DDR5): A server DRAM that effectively handles the increasing demands of larger and more complex data workloads by offering enhanced bandwidth and power efficiency compared to the previous generation, DDR4.
⁽⁴⁾ Registered Dual In-line Memory Module (RDIMM): A high-density memory module used in servers and other applications to vertically connect DRAM dies.
⁽⁵⁾ Multiplexer Combined Ranks Dual In-line Memory Module (MCR DIMM): A module product with multiple DRAMs bonded to a motherboard in which 2 ranks – basic information processing units – operate simultaneously, resulting in improved speed.
^{( 6)} Low Power Compression Attached Memory Module 2 (LPCAMM2): LPDDR5X-based module solution that offers power efficiency and high performance as well as space savings. It offers performance levels equivalent to two DDR5 SODIMMs, making it optimized for on-device AI.
⁽⁷⁾ QLC: A form of NAND flash memory that can store up to 4 bits of data per memory cell.
⁽⁸⁾ Heterogeneous Memory Software Development Kit (HMSDK): A software development kit specially designed to support CXL memory, a next-generation memory system based on the CXL open industry standard.