Hoya Assigned Patent

Hoya Corporation, Tokyo, Japan, has been assigned a patent (11955151) developed by Osakabe, Kinobu, Tokorozawa, Japan, for “substrate for magnetic disk and magnetic disk.“

The abstract of the patent published by the U.S. Patent and Trademark Office states: “A substrate for a magnetic disk includes a substrate main body having a disk shape and an alloy film. The substrate has a thickness (T+D) of 0.520 mm or less, which is the sum of a thickness T of the substrate main body and a thickness D of the film formed on main surfaces of the substrate main body. The disk shape has an outer diameter of 90 mm or more. A ratio D/T of the thickness D to the thickness T is 0.025 or more. The thickness of the film formed on an outer circumferential edge surface of the substrate main body is greater than the thickness of the film formed on each of the main surfaces, and the thickness of the film formed on each of the main surfaces is 80% or more of the thickness of the film formed on the outer circumferential edge surface.”

The patent application was filed on 2022-12-12 (18/079849).