ATP Electronics Introduces S650Si (TLC) and S750Pi (pSLC) Series SD and microSD Up 512GB Cards with 176-Layer 3D NAND

ATP Electronics, Inc. introduces its S650Si (TLC) and S750Pi (pSLC) Series SD and microSD memory cards built with 176-layer 3D NAND technology and low-density parity check (LDPC) controller.

With expanded capacity offerings up to 512GB and 5-year extended supply longevity support, the new memory cards are targeted for growing segments spurred by 5G, AI, and edge technologies, such as AI-enabled surveillance, smart homes, mobile monitoring, automotive recorders, remote healthcare, and security surveillance systems requiring heavy write and re-write usage.

High endurance: Best-in-class cost/GB memory card solutions

• Native TLC mode
  High endurance is critical in any non-stop recording environment. With capacities ranging from 64 to 512GB, the S650Si Series is rated for 5K+ P/E cycles and Terabytes Written (TBW) of up to 2,000TB.

• pSLC configuration
  For customers requiring an even higher-endurance solution, the S750Pi Series pseudo SLC configuration offers up to 100,000+ P/E cycles and TBW rating of up to 12,670TB. These memory cards are available in capacities from 16 to 128GB.

Both configurations are I-Temp operable and feature power loss protection technology, making them suitable for systems installed in extreme conditions with temperature shifts from -40°C to 85°C and unstable power supply settings. Compared with previous-gen firm’s SD/microSD offerings, the new memory cards also offer 3X faster sequential write and better sustained writing performance.

The graph below shows that based on 13Mb/s (lowest bitrate of HD recording) tested at 128GB capacity point, firm’s 176-layer TLC cards deliver extended recording hours compared to competitors with the same storage capacity and also present a cost-effective solution for video recording.

• Tested using 128GB ATP S650 TLC card based on 13Mb/s (lowest bitrate of HD recording) in best-case/ideal scenario, with no other influencing factors.
• Information sourced by ATP from publicly available data. To record new data, the oldest data will be overwritten when the card is full. 1Mbps=1,000,000bps

AI surveillance infrastructures: We build with you
With the rapid advancement of AI technology and the proliferation of edge computing infrastructure and applications, the company is capable of addressing diverse, application-specific needs through its mass production infrastructure. Its developed firmware and hardware configurations can meet customers’ unique requirements.

• SD Life Monitor: Intelligent workload inspection
  The firm’s SD Life Monitor tool provides ‘Workload Inspection.’ This gives customers a quick look of the write operation and file size by the host systems pre-qualification. The information is presented as a pie graph for ease of monitoring.

Considering the NAND flash page size and FW algorithm, the company then provides recommendations and more information for the host devices’ program data based on the multiples of minimum data transfer size in SD/microSD card datasheet.

Upon tuning according to workload inspection, the firm’s memory cards exhibited consistent latency performance when compared to untuned memory card solutions.

Stable latency ensures consistent performance even after long-term writing, ensuring good-quality continuous video recording. This is especially important for applications like DVRs, where unexpected latency can result in frame dropping or low recording quality.

In the following graph, the company’s TLC solutions with optimized latency (blue) maintain stable performance, which ensures high quality real-time video recording even after long-term writing. In contrast, unoptimized solutions (gray) show latency spiking up after a period of programming.

Click to enlarge

• Joint validation service
  The company performs compatibility and function tests using client-supplied host devices and systems to proactively detect and minimize failures that may not have been caught in production tests. Below are joint validation tests optimized according to application needs.

  • Software joint integration
  • Compatibility study and test
  • Device signal measurement
  • Function/performance enhancement
  • Additional tests (e.g., industrial standard, power cycling test)

• Advanced card analysis
  System-in-Package (SiP) wafer/die process makes firm’s memory cards resistant to water, dust, and shock; however, it also makes it difficult to perform component analysis compared to SMT (surface-mount technology) process. The firm’s uniquely designed substrate and debug tool make post-analysis possible.

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