Alliance Memory AS9F Series of 1.8V and 3.3V SLC Parallel NAND Flash Memory Solutions
Compliant with ONFI 1.0 spec, 1Gb to 8Gb delivering block erase times down to 3ms
This is a Press Release edited by StorageNewsletter.com on August 2, 2023 at 2:01 pmTo meet the increasing demand for legacy SLC parallel NAND flash memory products in the automotive, industrial, communications, and consumer electronics markets, Alliance Memory introduced the AS9F series of 1.8V and 3.3V devices with densities from 1Gb to 8Gb and fast block erase times down to 3ms typical.
“While new designs are migrating toward serial NAND flash for mass storage, many of our customers’ existing designs still require parallel NAND flash solutions, which are becoming increasingly difficult to find,” said David Bagby, president and CEO. “With our AS9F series, we’re perfectly positioned to provide our customers with a reliable source for these cost-effective solutions moving forward, saving them the expense of redesigns.”
Compliant with the ONFI 1.0 spec and offering an x8 I/O interface, the memory solutions released are for use in chipsets for Wi-Fi routers, DSL and cable modems, set-top boxes, digital TVs, AI speakers, IoT devices, and more. Divided into blocks that can be erased independently, AS9F series products allow valid data to be preserved in these applications while old data is erased.
Delivering reliable, long-term performance, the parallel NAND flash devices feature 100,000 program/erase cycles – with 4-bit ECC per 528 bytes – and 10-year data retention. Offered in the 9.0×11.0x1.0 mm 63-ball FBGA package, the RoHS-compliant solutions are available in industrial (-40°C to +85°C) and automotive (-40°C to +105°C) temperature ranges.
Device specs table:
Part # |
Density |
Bus width |
Vcc |
Package |
Temperature |
AS9F31G08SA-25BIN |
1Gb |
x8 |
3.3V |
63-ball FBGA |
-40°C to +85°C |
AS9F32G08SA-25BIN |
2Gb |
x8 |
3.3V |
63-ball FBGA |
-40°C to +85°C |
AS9F34G08SA-25BIN |
4Gb |
x8 |
3.3V |
63-ball FBGA |
-40°C to +85°C |
AS9F14G08SA-45BIN |
4Gb |
x8 |
1.8V |
63-ball FBGA |
-40°C to +85°C |
AS9F38G08SA-25BIN |
8Gb (DDP) |
x8 |
3.3V |
63-ball FBGA |
-40°C to +85°C |
AS9F18G08SA-45BIN |
8Gb (DDP) |
x8 |
1.8V |
63-ball FBGA |
-40°C to +85°C |
AS9F14G08SA-45BAN |
4Gb |
x8 |
1.8V |
63-ball FBGA |
-40°C to +105°C |
AS9F18G08SA-45BAN |
8Gb (DDP) |
x8 |
1.8V |
63-ball FBGA |
-40°C to +105°C |
Samples and production quantities of the 1.8V and 3.3V SLC parallel NAND flash memory products are available, with lead times of 12 weeks.