Trusted Semiconductor and Avalanche Technology Partners to Provide SpaceVPX SBC Solutions

Avalanche Technology, Inc. is providing its Space Grade Persistent SRAM (P-SRAM) products for a Radiation Hardened SpaceVPX Single Board Computer (SBC), developed by industry partner Trusted Semiconductor Solutions (TSS).

Based in Minneapolis, TSS is a long time stalwart for the radiation hardened ecosystem, providing valuable products and services in support of this community’s highly specialized requirements.

This SpaceVPX hardware platform will be one of the 1st to leverage the recently announced partnership between Avalanche Technology and Eidetic Communications Inc., provider of terrestrial NVMe storage solutions, for an envisioned rollout of data buffers and data centers in space. Set for availability in 3Q23, this SpaceVPX platform from TSS will build on its device and system level domain expertise, and optionally layer in Eideticom’s efficient NVMe software stack for a customizable and scalable platform solution in support of a variety of evolving program needs. Additional detail about this platform and others resulting from this partnership will be outlined by Paul Chopelas, GM, Avalanche, at the IEEE Space Computing Conference on Tuesday, July 18, which is being held at Caltech and is sponsored by NASA Jet Propulsion Laboratory.

“By combining Avalanche’s industry leading high-reliability, endurance and density Space Grade MRAM with Eideticom’s efficient NVMe stack software and TSS’s decades of experience providing radiation hardened hardware, the industry is one step closer to realizing a seamless and resilient distributed storage network in space,” said Danny Sabour, VP, marketing and business development, Avalanche. “We are delighted to partner with leading industry providers like Trusted Semiconductor Solutions.”

“By leveraging Avalanche’s MRAM technology and optional NVMe software stack from Eideticom, Trusted Semiconductor Solutions will deliver innovative, reconfigurable compute and storage solutions to the Aerospace & Defense community in addition to other high reliability applications,” said Al Hurst, president and CEO, TSS. “Building on TSS’s rich heritage as a trusted partner in the radiation hardened ecosystem, this tailorable SWaP-optimized platform offers a key ingredient for distributed secure computing storage in space, required for mission adaptability.”

Gen 3 Persistent SRAM
The Gen 3 Space Grade families are offered as a standard product in parallel with asynchronous SRAM-compatible timing and dual QuadSPI high speed serial interface in various density options from 1 to 8Gb. Data is always non-volatile and space grade devices have industry leading write cycle endurance at 10^16. The devices are offered in small footprint packaging and extended operating temperature range (-40°C to 125°C) with a JEDEC qualification flow, where every device goes through a 48-hour burn in before being shipped to customers. There are additional qualification screening options available through partners.