JEDEC Published JESD312 Automotive SSD Device Standard V1.0

JEDEC Solid State Technology Association published JESD312 Automotive SSD Device Standard V1.0.

JESD312 defines the packaging, protocol, environmental requirements, and electrical interface for an SSD targeted at use in automotive and similar ruggedized applications. JESD312 is available for download from the JEDEC website (registration required).

Vehicles have increasingly become data centers on wheels, and the emergence of this new standard reflects that reality as protocols already popular in servers are now moving into cars. JESD312 Automotive SSD standard defines a standard family of BGA devices for solder-down use in rugged environments. It includes a PCIe 4.0 interface with 4 data lanes for a maximum throughput of 8GB/s, NVMe command protocols common in data center applications, security encryption code support, and an operating range from -40°C to +105°C.

The JESD312 standard is also forward-looking, allowing options such as split-partition storage arrays that separate the operating system from applications code, and support for single root input/output virtualization (SR/IOV) for applications with many processors sharing the SSD resource.

“JEDEC’s new Automotive SSD standard is designed to meet industry demand for a standardized device that responds to the requirements of the next generation of cars, including self-driving vehicles. In addition, the need for industrial applications was taken into consideration, growing the market for these chips,” said Jeffrey Chung, chair, automotive task group that developed the standard.

Mian Quddus, chairman, board, JEDEC, added; “Having the industry consolidate on a single package, pinout, and protocol will allow for many end users and many device suppliers to rapidly grow the market for drop-in compatible SSDs in these emerging applications. JESD312 offers the opportunity to reduce the costs and risks across the board.”