Dapu Microelectronics Assigned Patent

Shenzhen Dapu Microelectronics Co., Ltd., Shenzhen, China, has been assigned a patent (11,435,953) developed by Jiang, Li, Chen, Xiang, and Li, Weijun, Shenzhen, China, for “method for predicting LBA information, and SSD.“

The abstract of the patent published by the U.S. Patent and Trademark Office states: “A method for predicting logical blocks address (LBA) information, including: receiving, by a Solid State Drive (SSD), a trace sent from a host, wherein the host can acquire the trace in a reusable environment; determining, by the SSD, one or more LBAs received by the SSD according to the trace; obtaining, by the SSD, a distribution of the LBAs by learning the LBAs based on a preset learning algorithm; and predicting, by the SSD, one or more subsequent LBAs based on the distribution of the LBAs. As a result, it can perform heat classification and prediction of the following LBA used in the SSD by means of learning the LBA distribution of the SSD in a certain reusable environment of the host, thus to improve the hit rate of reading and writing and the efficiency of classification of hot and cold data in garbage collection.”

The patent application was filed on December 3, 2020 (17/111,493).