Industry-University Cooperation Foundation Hanyang University Assigned Patent
3D semiconductor memory, operating method of same and electronic system
By Francis Pelletier | October 13, 2022 at 2:00 pmIndustry-University Cooperation Foundation Hanyang University, Seoul, Korea, has been assigned a patent (11,456,319) developed by Song, Yun Heub, Seongnam-si, Korea, Choi, Sun Jun, Namyangju-si, Korea, Choi, Chang Hwan, and Jeong, Jae Kyeong, Seoul, Korea, for “three-dimensional semiconductor memory device, operating method of the same and electronic system including the same.“
The abstract of the patent published by the U.S. Patent and Trademark Office states: “Provided are a three-dimensional semiconductor memory device, a method for manufacturing the same, a method for operating the same, and an electronic system including the same. The three-dimensional semiconductor memory device includes a substrate, a stack structure on the substrate, and vertical channel structures, which are provided in channel holes penetrating the stack structure, wherein each of the vertical channel structures includes a data storage pattern, a vertical channel pattern, a conductive pad, and a vertical semiconductor pattern, wherein the vertical channel pattern includes a first portion contacting the upper surface of the substrate and a second portion provided between the data storage pattern and the vertical semiconductor pattern, and wherein the vertical semiconductor pattern is spaced apart from the substrate with the first portion of the vertical channel pattern therebetween.”
The patent application was filed on May 25, 2021 (17/329,907).