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Kioxia America Introduces Industrial Grade Flash Memory Devices with BiCS Flash 3D and TLC Technology

Temperature from -40°C to +85°C, available in 132-BGA package, and densities range from 512Gb (64GB) to 4Tb (512GB)

Kioxia America, Inc. has introduced industrial grade flash memory devices.

Kioxia Bics Flash 2209

This lineup utilizes the latest gen BiCS FLASH 3D flash memory with TLC) technology, and is available in a 132-BGA package. Densities range from 512Gb (64GB) to 4Tb (512GB) to support the requirements of industrial applications – including telecommunication, networking, and embedded computing.

The storage requirements for many industrial applications stand in stark contrast to those of SSDs designed to be housed in climate-controlled data centers – including the need for extended temperature ranges and the ability to maintain reliability and performance in rugged operating conditions. Designed with these needs in mind, these company’s devices support a wide temperature range (-40°C to +85°C) and offer suitable products for the industrial market.

Due to the fact that flash memory cell performance and reliability improve with a smaller number of bits per cell, these devices feature SLC mode for applications that require faster RW times and high cell endurance.

As a large supplier of flash memory, the firm is committed to supporting multiple industrial grade solutions and accommodating applications that have long life cycles.

The addition of next-gen industrial grade BiCS FLASH 3D flash memory continues our commitment to supporting the industrial market segment,” said Brian Kumagai, director, business development. “Kioxia also offers wide temperature range (-40°C to +85°C) low density SLC flash memory solutions designed to support industrial applications.” 

Sampling of the industrial grade flash memory devices commenced earlier this year, with mass production expected late in the 4Q22

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