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SK hynix Selected Lam Research’ Dry Resist Fabrication Technology to Enhance DRAM Production Cost Efficiency

Dry resist extends resolution, productivity, and yield of Extreme Ultraviolet lithography, technology used in production of next-gen semiconductors.

Lam Research Corp. announced that SK hynix Inc. has selected its dry resist fabrication technology as a development tool of record for 2 key process steps in the production of advanced DRAM chips.

Lam Research Dry Resist Intro 2206

A technology introduced by Lam in 2020, dry resist extends the resolution, productivity, and yield of Extreme Ultraviolet (EUV) lithography, a pivotal technology used in the production of next-gen semiconductors.

Through the firm’s work with SK hynix and ongoing collaboration with ecosystem partners on dry resist technology, the company continues to take a role in driving patterning innovations to remove the roadblocks associated with scaling to future memory nodes with EUV lithography.

The company announces that SK hynix has chosen dry resist technology for production of advanced DRAM chips.

Lam’s dry resist technology is a game-changer. By innovating at the material level, it addresses EUV lithography’s biggest challenges, enabling cost-effective scaling for advanced memory and logic,” said Richard Wise, VP and GM, dry resist product group, Lam. “We are proud to continue our long-standing collaboration with SK hynix to accelerate DRAM technology innovations.”

SK hynix intends to use the company’s dry resist underlayer and dry development processes for advanced DRAM patterning.

As DRAM continues to scale, innovations in EUV patterning are critical for delivering the performance needed for today’s increasingly connected devices at a cost that is right for our customers,” said BK Lee, head, R&D process, SK hynix. “The dry resist technology that we are working on with Lam enables exceptionally precise, low defect, and lower cost patterning.

As chipmakers move to advanced technology nodes, they must resolve ever smaller and finer chip designs on the wafer. First developed by Lam in collaboration with ASML and IMEC, dry resist technology offers several advantages over conventional chemically amplified resist patterning for EUV lithography. Dry resist technology solutions enhance EUV sensitivity and the resolution of each wafer pass, enabling patterns to better adhere to the wafer and improving performance and yield. In addition, the company’s dry resist development approach offers sustainability benefits by consuming less energy and 5 to 10x less raw materials than traditional chemical wet resist processes.

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