Giga-Byte Technology Assigned Two Patents

SSD and startup method
Giga-Byte Technology Co., Ltd., New Taipei, Taiwan, has been assigned a patent (11,226,863) developed by Chen, Hung-Cheng, and Liao, Tse-Hsien, New Taipei, Taiwan, for “solid-state disk and startup method.“

The abstract of the patent published by the U.S. Patent and Trademark Office states: “A solid-state disk and a startup method are provided. The solid-state disk includes a control circuit, a firmware switching circuit, a first firmware storage unit, and a second firmware storage unit. The firmware switching circuit is coupled to the control circuit. The first firmware storage unit is coupled to the firmware switching circuit and stores a first firmware. The second firmware storage unit is coupled to the firmware switching circuit and stores a second firmware. The control circuit reads the first firmware storage unit or the second firmware storage unit according to whether the firmware switching circuit is triggered so as to startup according to the first firmware or the second firmware.”

The patent application was filed on December 13, 2020 (17/120,247).

Heat dissipation assembly of M.2 expansion card and electronic device
Giga-Byte Technology Co., Ltd., New Taipei, Taiwan, has been assigned a patent (11,191,149) developed by Chien, Yuan-Li, and Chang, Yen-Yun, New Taipei, Taiwan, for “heat dissipation assembly of M.2 expansion card and electronic device.“

The abstract of the patent published by the U.S. Patent and Trademark Office states: “A heat dissipating assembly of M.2 expansion card is adapted to fix an M.2 expansion card to a motherboard, and includes a heat dissipating body having a first end and a locking member. The heat dissipating body includes a fixed portion located at the first end and at least one screw hole, and the heat dissipating body is adapted to be fixed to the motherboard through the fixed portion. The locking member is detachably disposed on the at least one screw hole, and the locking member is adapted to fix the M.2 expansion card to the heat dissipating body.”

The patent application was filed on January 8, 2020 (16/736,840).