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Global Uniship and TMSC Assigned Two Patents

Solid-state storage, interface method for 3D semiconductor

Solid-state storage
Global Uniship Corp. Hsinchu, Taiwan, and Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, Taiwan, has been assigned a patent (11,201,100) developed by Shih, Yu-Ting, Hung, Chen-Wei, and Chen, Jia-Liang, Hsinchu, Taiwan, f...

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