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Weebit Nano Receives First Silicon Demo Wafers Integrating Embedded ReRAM Module

Milestone in company's commercialisation roadmap achieved on-time

Weebit Nano Ltd. received from manufacturing the first silicon wafers that integrate its embedded Resistive Random-Access Memory (ReRAM) module inside complete subsystem demo chips.

Weebit Nano Cea Leti Intro

These integrated chips will be used for testing and characterisation, as well as for demo to potential customers. Importantly, the demo chips will allow customers to run applications to test the company’s ReRAM technology ahead of potential commercial orders and volume production for their specific chips.

The firm worked with its development partner CEA-Leti to manufacture the demo wafers. The wafers will now be sliced into chips, packaged, and then tested, characterised and qualified. Chips based on this design will be used for the qualification process in SkyWater Technology’s US production fab. The transfer of the company‘s embedded ReRAM technology to SkyWater’s production fab is progressing on schedule.

Coby Hanoch, CEO, said: “We are proud to deliver another significant commercialisation milestone on-time. The demo chips integrating Weebit’s ReRAM module will support the adoption of our technology by potential customers looking to address the shortcomings of flash memory. We will now be able to provide customers with a fully functional ReRAM technology that can be readily integrated into their Systems-on-Chips [SoCs] to facilitate the design of new embedded products that are moving beyond flash.

The firm’s embedded ReRAM module includes a 128Kb ReRAM array, control logic, decoders, IOs (Input/Output communication elements) and ECC. It is designed with patent-pending analog and digital smart circuitry that enhances the memory array’s technical parameters including speed, retention, and endurance.  It is customisable and will provide a foundation for the company’s future ReRAM compiler.

In addition to the company’s ReRAM module, the demo chip includes a RISC-V microcontroller (MCU), system interfaces, SRAM and peripherals – all together comprising a full subsystem for embedded applications.

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