Getac Technology Assigned Patent
Heat-dissipating, shock-absorbing structure
By Francis Pelletier | December 17, 2021 at 2:00 pmGetac Technology Corporation, Hsinchu County, Taiwan, has been assigned a patent (11,189,323) developed by Cheng, Hung-Chan, Taipei, Taiwan, for “heat-dissipating, shock-absorbing structure.“
The abstract of the patent published by the U.S. Patent and Trademark Office states: “Provided is a heat-dissipating, shock-absorbing structure which is applicable to an electronic module with a hard disk drive. The heat-dissipating, shock-absorbing structure includes a heat-dissipating frame, an elastomer, and a plurality of heat conduction layers. The heat-dissipating frame has a fixing segment and two extending segments. The extending segments connect with two ends of the fixing segment. The fixing segment connects with one side of the hard disk drive. The distance between the extending segments is greater than the thickness of the hard disk drive. At least a portion of the elastomer is disposed at the extending segments. The heat conduction layers cover the elastomer.”
The patent application was filed on October 26, 2018 (16/171,483).











