Hongfujin Precision Electronics Assigned Four Patents

Storage system
Hongfujin Precision Electronics (Tianjin) Co., Ltd., Tianjin, China, has been assigned a patent (11,074,942) developed by Lin, Jia-Feng, Lin, Chieh-Hsiang, Wang, Wen-Chen, and Kuo, Chih-Hung, New Taipei, Taiwan, for a “storage system.“

The abstract of the patent published by the U.S. Patent and Trademark Office states: ”A storage system includes a chassis, a storage module, and a controller module. The storage module and the controller module are mounted to the chassis. The storage module includes a housing, a storage member, and an adapter plate. The storage member is fixed to the housing and is configured to store data. The adapter plate is fixed to the housing and is detachably connected to the storage member and the controller module.”

The patent application was filed on August 23, 2019 (Appl. No.16/549,137).

Injecting deliberate errors into PCIE device for test purposes, apparatus,
and computer readable storage medium for code
Hongfujin Precision Electronics (Tianjin) Co., Ltd., Tianjin, China, has been assigned a patent (11,023,343) developed by Yang, Cheng-Da, Neihu, Taiwan, and Chen, Yen-Hsuan, New Taipei, Taiwan, for “method for injecting deliberate errors into PCIE device for test purposes, apparatus applying method, and computer readable storage medium for code of method.“

The abstract of the patent published by the U.S. Patent and Trademark Office states: ”A method for injecting specific errors of both correctable and non-correctable types into a PCIE device for testing purposes during fabrication stage constructs an error injecting platform based on received target information. The platform includes a control system and at least one testing system. Disabling a security boot in the connected testing system and obtaining information of the specified driver. The obtained information comprises objects to be tested according to selection, each object having a bus address and a PCIE port value. The object under test is controlled to inject a specified error, the injection and result of injection being reported by the processor and analyzed.”

The patent application was filed on May 13, 2019 (Appl. No.16/410,058).

Hard disk drive tray and HDD tray module
Hongfujin Precision Electronics (Tianjin) Co., Ltd., Tianjin, China, has been assigned a patent (11,011,207) developed by Lu, Wen-Hu, Tianjin, China, for “hard disk drive tray and hard disk drive tray module.“

The abstract of the patent published by the U.S. Patent and Trademark Office states: ”A hard disk drive tray includes a tray body, a handle, and two elastic locking members. The tray body includes a bottom wall and two side walls. A first evading groove is defined in each side wall. The side wall includes a first clamping portion. The handle includes two handle operating portions and a beam portion. The handle operating portion is connected to the side wall. A second clamping portion is formed in the first limiting groove. Each elastic locking member includes a first side portion, a top portion, and a locking portion. A third clamping portion is formed on the first side portion. The locking portion is blocked by the second clamping portion, and the third clamping portion is blocked by the first clamping portion. When the elastic locking member is pushed toward the second clamping portion, the third clamping portion is separated from the first clamping portion.”

The patent application was filed on September 29, 2020 (Appl. No.17/036,327).

HDD detection
Hongfujin Precision Electronics (Tianjin) Co., Ltd., Tianjin, China, has been assigned a patent (10,977,205) developed by Qiu, Duo, and Ma, Yu-Jie, Shenzhen, China, for a “HDD detection system.“

The abstract of the patent published by the U.S. Patent and Trademark Office states: ”A system for detecting HDDs and in-position states of each of them includes an HDD controller, an analysis module, and a BMC chip. The HDD controller is electrically connected to the HDDs for obtaining SGPIO information and outputting testing signals comprising the SGPIO information. The analysis module receives the testing signals and generates in-position state information according to voltage levels of the testing signals. The BMC chip is electrically connected to the analysis module. The BMC chip receives the in-position state information from the analysis module and generates a detection log accordingly.”

The patent application was filed on November 4, 2019 (Appl. No.16/672,832).