Apacer Technology Assigned Patent

Apacer Technology Inc., New Taipei, Taiwan, has been assigned a patent (10,966,345) developed by Chen, Chien-Pang, Lin, Min-Lung, Kuo, Chih-Hung, and Tsai, Sung-Yu, New Taipei, Taiwan, for a “solid-state drive heat dissipation device.“

The abstract of the patent published by the U.S. Patent and Trademark Office states: ”A solid-state drive (SSD) heat dissipation device is disclosed. The SSD heat dissipation device comprises a solid-state drive substrate, a chip heat dissipation component, a memory heat dissipation component, and a spacer. A control IC and a flash memory are disposed on the solid-state drive substrate, the chip heat dissipation component is disposed on the control IC, and the memory heat dissipation component is disposed on the flash memory. The chip heat dissipation component and the memory heat dissipation component are disposed separately.”

The patent application was filed on January 10, 2020 (16/739,238).