R&D: FPGA-Based Reliability Testing and Analysis for 3D NAND Flash

Microelectronics Reliability has published an article written by Debao Wei, Zhelong Piao, Hua Feng, Liyan Qiao, and Xiyuan Peng, School of Electronics and Information Engineering, Harbin Institute of Technology, Harbin, PR China.

Abstract: “In this article, we described a FPGA-based NAND flash memory hardware and software collaborative design experimental platform. Our novel experimental platform implements timing control and error feature extraction of NAND flash memory, equipped with a computer software based on LabVIEW. The test results show that our test platform can process the experimental data with high speed, stability and accuracy so that users can effectively evaluate the storage system indicators based on NAND flash memory. In addition, we conducted research on a newly discovered 3D NAND flash memory reliability threat which exists in reading an idle block.“