FMS 2020: Advantest to Feature End-to-End Flash Memory and SSD Test Solutions

Semiconductor test equipment supplier Advantest Corporation will showcase its latest storage and memory test solutions at the Flash Memory Summit, North America’s solid-state storage conference, on November 10-12, 2020. 

At this year’s event, it will exhibit its MPT3000ARC, a test platform to combine extreme thermal-control capability with high throughput testing of high power SSDs.

The MPT3000 product family, which is already in use by SSD manufacturers, supports SSD testing from design to manufacturing, providing a fast, low risk path to market for next-gen devices, including PCIe Gen 4.

With the addition of the MPT3000ARC, the MPT3000 series enables rapid changeover to provide users with a single-system test solution for a variety of SSD products, ranging from 40mm M.2 memories to larger EDSFF devices. In addition to meeting automotive thermal test standards, its automation-ready thermal chamber allows SSD manufacturers to ramp temperatures, which optimizes Reliability Demonstration Test (RDT) and results in faster time to market.

Furthermore, the cmpany will showcase its T5800 series for DRAM and flash memory testing, covering all testing needs from wafer sort to final system test, spanning across engineering to production environments.

The T5851 system is designed to provide a test solution for evaluating high-speed protocol NAND flash memories, including UFS3.X universal flash storage and PCIe Gen 4 NVMe SSDs.

The T5833 system, a high-volume test solution, can perform both wafer sort and final test of DRAM and NAND flash memory devices, including LPDDR3-DRAMs, high-speed NAND flash memories and next-gen non-volatile memory ICs.