Kioxia: XD6 Series E1.S Form Factor PCIe 4.0 and NVMe 1.3c Spec-Compliant SSD

Kioxia Corporation expanded its portfolio of client, enterprise and data center SSDs with the addition of the XD6 Series E1.S form factor SSDs.

XD6 Series are the first^[1] E1.S SSDs to address the specific requirements of hyperscale applications, including the performance, power and thermal requirements of the Open Compute Platform (OCP) ^[2] ‘NVMe Cloud SSD spec‘. The XD6 drives are sampling to select data center customers.^[3]

Designed to maximize system density, efficiency and simplicity, the EDSFF E1.x SSDs represent the future of flash storage for servers in cloud and hyperscale data centers. Leveraging the OCP ‘NVMe Cloud SSD spec’, the flexible small form factor E1.S replaces the bare module M.2 form factor and delivers density, performance, reliability and thermal management. E1.S is also designed to be hot pluggable for increased serviceability, which is another benefit over M.2.

PCIe 4.0 and NVMe 1.3c spec-compliant, XD6 Series is available in E1.S 9.5, 15, and 25mm form factors. This series were designed for performance, low latency and reliability in 24×7 cloud data centers.

Key features include:

Sequential RW performance up to 6,500MB/s and 2,400MB/s respectively
15W power consumption
Security options: TCG Opal ^[4]
End-to-end data path protection
Power loss protection
Expanded drive health information
Consistent performance and low latency vs. data center loads
New in-house developed, hyperscale-optimized controller

The company is an active and contributing member to the industry development of EDSFF E1.S/L and E3.S/L solutions, and continues to collaborate with server and storage system developers to unlock the full power of flash memory, NVMe and PCIe.

^[1] As of November 4, 2020. Kioxia Corporation survey.
^[2] Open Compute Project (OCP) is a collaborative community, advocated by Microsoft Corp. and Facebook, Inc., focused on redesigning hardware technology to efficiently support the growing demands on compute infrastructure.
^[3] Engineering samples are for OEM customer evaluation. The specs may differ from those at the time of mass production.
^[4] Availability of security/encryption options may vary by region.

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