Shenzhen Longsys Electronics Assigned Patent

Shenzhen Longsys Electronics Co., Ltd., Shenzhen, China, has been assigned a patent (10,714,148) developed by Li, Zhixiong, Pang, Weiwen, Li, Xiaoqiang, Hu, Honghui, and Qin, Jinmou, Shenzhen, China, for “SSD storage module, SSD component, and SSD.“

The abstract of the patent published by the U.S. Patent and Trademark Office states: ”A SSD storage module comprising a printed circuit board, an encapsulating colloid, and an electronic circuit welded on an inner surface of the printed circuit board and having a data storage function, the encapsulating colloid is formed on the inner surface of the printed circuit board and is configured for seamlessly encapsulating the electronic circuit, an outer surface of the printed circuit board is provided with a plurality of metal contact pieces, the plurality of metal contact pieces are electrically connected with the electronic circuit, and the plurality of metal contact pieces comprise a plurality of SATA interface contact pieces. The encapsulating colloid seamlessly encapsulates the electronic circuit and isolates the electronic circuit from the air, such that a problem that the electronic circuit is directly exposed to the air, and performances of components of the electronic circuit may be affected, thereby resulting in an unstable functionality of a SSD can be avoided.”

The patent application was filed on July 16, 2019 (16/513,370).