Adata Assigned Patent

Adata Technology Co. Ltd., New Taipei, Taiwan, has been assigned a patent (10,609,842) developed by Yin, Yung-Hsing, and Pan, Jen-Chieh, New Taipei, Taiwan, for “storage assembly and storage module structure thereof.“

The abstract of the patent published by the U.S. Patent and Trademark Office states: ”A storage module structure of a storage assembly includes an upper shielding component, a lower shielding component and a memory component. An outer surface of the upper shielding component has a plurality of heat-conducting units. The lower shielding component is located above the upper shielding component, and an accommodating space is defined between the upper shielding component and the lower shielding component. The memory component is located in the accommodating space. The heat-conducting units contact an external structure, and a thermal energy generated by the memory component is conducted to the external structure through the plurality of heat-conducting units.”

The patent application was filed on June 26, 2018 (16/018,824).